Thermally-isolated silicon-based integrated circuits and related methods
Abstract
Thermally isolated devices may be formed by performing a series of etches on a silicon-based substrate. As a result of the series of etches, silicon material may be removed from underneath a region of an integrated circuit (IC). The removal of the silicon material from underneath the IC forms a gap between remaining substrate and the integrated circuit, though the integrated circuit remains connected to the substrate via a support bar arrangement that suspends the integrated circuit over the substrate. The creation of this gap functions to release the device from the substrate and create a thermally-isolated integrated circuit.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1356199
- Patent Number(s):
- 9646874
- Application Number:
- 13/959,136
- Assignee:
- Sandia Corporation
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Aug 05
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 42 ENGINEERING
Citation Formats
Wojciechowski, Kenneth, Olsson, Roy H., Clews, Peggy J., and Bauer, Todd. Thermally-isolated silicon-based integrated circuits and related methods. United States: N. p., 2017.
Web.
Wojciechowski, Kenneth, Olsson, Roy H., Clews, Peggy J., & Bauer, Todd. Thermally-isolated silicon-based integrated circuits and related methods. United States.
Wojciechowski, Kenneth, Olsson, Roy H., Clews, Peggy J., and Bauer, Todd. Tue .
"Thermally-isolated silicon-based integrated circuits and related methods". United States. https://www.osti.gov/servlets/purl/1356199.
@article{osti_1356199,
title = {Thermally-isolated silicon-based integrated circuits and related methods},
author = {Wojciechowski, Kenneth and Olsson, Roy H. and Clews, Peggy J. and Bauer, Todd},
abstractNote = {Thermally isolated devices may be formed by performing a series of etches on a silicon-based substrate. As a result of the series of etches, silicon material may be removed from underneath a region of an integrated circuit (IC). The removal of the silicon material from underneath the IC forms a gap between remaining substrate and the integrated circuit, though the integrated circuit remains connected to the substrate via a support bar arrangement that suspends the integrated circuit over the substrate. The creation of this gap functions to release the device from the substrate and create a thermally-isolated integrated circuit.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {5}
}
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