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Title: High-density, fail-in-place switches for computer and data networks

A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
Inventors:
; ; ; ; ;
Issue Date:
OSTI Identifier:
1353058
Assignee:
International Business Machines Corporation OSTI
Patent Number(s):
9,634,959
Application Number:
14/548,345
Contract Number:
B601996
Resource Relation:
Patent File Date: 2014 Nov 20
Research Org:
International Business Machines Corporation, Armonk, NY (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
97 MATHEMATICS AND COMPUTING

Other works cited in this record:

Leadless chip carrier with frangible shorting bars
patent, October 1985

High density interconnect apparatus
patent, December 1992

Simplified switching interconnect using wavelength division multiplexing
patent, June 2008

Optical network for cluster computing
patent, January 2012

Efficient highly connected data centers
patent, March 2013

Method and system for multi level switch configuration
patent, September 2013


conference, February 2014
  • Reinemo, Sven-Arne; Bogdanski, Bartosz; Johnsen, Bjorn Dag
  • 2014 22nd Euromicro International Conference on Parallel, Distributed, and Network-Based Processing
  • DOI: 10.1109/PDP.2014.22

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