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Title: Method for fabrication of ceramic dielectric films on copper foils

The present invention provides a method for fabricating a ceramic film on a copper foil. The method comprises applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250.degree. C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450.degree. C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750.degree. C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas. In some embodiments an additional layer of the sol-gel composition is applied onto the ceramic film and the drying, pyrolyzing and crystallizing steps are repeated for the additional layer to build up a thicker ceramic layer on the copper foil. The process can be repeated one or more times if desired.
Inventors:
; ; ;
Issue Date:
OSTI Identifier:
1349887
Assignee:
UChicago Argonne, LLC (Chicago, IL) ANL
Patent Number(s):
8,974,856
Application Number:
12/786,940
Contract Number:
AC02-06CH11357
Resource Relation:
Patent File Date: 2010 May 25
Research Org:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Other works cited in this record:

Photovoltaic device and manufacturing method of the same
patent, September 1997

Sol-gel precursor and method for formation of ferroelectric materials for integrated circuits
patent, January 2002

Substrate structure for growth of highly oriented and/or epitaxial layers thereon
patent, July 2005

Thin film dielectrics for capacitors and methods of making thereof
patent, April 2006

Lead zirconate titanate thin films directly on copper electrodes for ferroelectric, dielectric and piezoelectric applications
journal, February 2005
  • Kingon, Angus I.; Srinivasan, Sudarsan
  • Nature Materials, Vol. 4, Issue 3, p. 233-237
  • DOI: 10.1038/nmat1334

Importance Of Solution Chemistry In Preparing Sol–Gel PZT Thin Films Directly On Copper Surfaces
journal, January 2008
  • Losego, Mark D.; Ihlefeld, Jon F.; Maria, Jon-Paul
  • Chemistry of Materials, Vol. 20, Issue 1, p. 303-307
  • DOI: 10.1021/cm070999q

Chemical solution deposition of electronic oxide films
journal, May 2004
  • Schwartz, Robert W.; Schneller, Theodor; Waser, Rainer
  • Comptes Rendus Chimie, Vol. 7, Issue 5, p. 433-461
  • DOI: 10.1016/j.crci.2004.01.007

Chemical solution deposition of ferroelectric lead lanthanum zirconate titanate films on base-metal foils
journal, January 2008
  • Ma, Beihai; Kwon, Do-Kyun; Narayanan, Manoj
  • Journal of Electroceramics, Vol. 22, Issue 4, p. 383-389
  • DOI: 10.1007/s10832-007-9410-1

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