Method for fabrication of ceramic dielectric films on copper foils
Abstract
The present invention provides a method for fabricating a ceramic film on a copper foil. The method comprises applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250.degree. C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450.degree. C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750.degree. C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas. In some embodiments an additional layer of the sol-gel composition is applied onto the ceramic film and the drying, pyrolyzing and crystallizing steps are repeated for the additional layer to build up a thicker ceramic layer on the copper foil. The process can be repeated one or more times if desired.
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1349887
- Patent Number(s):
- 8974856
- Application Number:
- 12/786,940
- Assignee:
- UChicago Argonne, LLC (Chicago, IL)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01G - CAPACITORS
- DOE Contract Number:
- AC02-06CH11357
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2010 May 25
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Ma, Beihai, Narayanan, Manoj, Dorris, Stephen E., and Balachandran, Uthamalingam. Method for fabrication of ceramic dielectric films on copper foils. United States: N. p., 2015.
Web.
Ma, Beihai, Narayanan, Manoj, Dorris, Stephen E., & Balachandran, Uthamalingam. Method for fabrication of ceramic dielectric films on copper foils. United States.
Ma, Beihai, Narayanan, Manoj, Dorris, Stephen E., and Balachandran, Uthamalingam. Tue .
"Method for fabrication of ceramic dielectric films on copper foils". United States. https://www.osti.gov/servlets/purl/1349887.
@article{osti_1349887,
title = {Method for fabrication of ceramic dielectric films on copper foils},
author = {Ma, Beihai and Narayanan, Manoj and Dorris, Stephen E. and Balachandran, Uthamalingam},
abstractNote = {The present invention provides a method for fabricating a ceramic film on a copper foil. The method comprises applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250.degree. C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450.degree. C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750.degree. C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas. In some embodiments an additional layer of the sol-gel composition is applied onto the ceramic film and the drying, pyrolyzing and crystallizing steps are repeated for the additional layer to build up a thicker ceramic layer on the copper foil. The process can be repeated one or more times if desired.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {3}
}
Works referenced in this record:
Lead zirconate titanate thin films directly on copper electrodes for ferroelectric, dielectric and piezoelectric applications
journal, February 2005
- Kingon, Angus I.; Srinivasan, Sudarsan
- Nature Materials, Vol. 4, Issue 3, p. 233-237
Ferroelectric response from lead zirconate titanate thin films prepared directly on low-resistivity copper substrates
journal, April 2005
- Losego, Mark D.; Jimison, Leslie H.; Ihlefeld, Jon F.
- Applied Physics Letters, Vol. 86, Issue 17
Importance Of Solution Chemistry In Preparing Sol–Gel PZT Thin Films Directly On Copper Surfaces
journal, January 2008
- Losego, Mark D.; Ihlefeld, Jon F.; Maria, Jon-Paul
- Chemistry of Materials, Vol. 20, Issue 1, p. 303-307
Ferroelectric behavior in nominally relaxor lead lanthanum zirconate titanate thin films prepared by chemical solution deposition on copper foil
journal, June 2006
- Kim, Taeyun; Hanson, Jacqueline N.; Gruverman, Alexei
- Applied Physics Letters, Vol. 88, Issue 26
Chemical solution deposition of electronic oxide films
journal, May 2004
- Schwartz, Robert W.; Schneller, Theodor; Waser, Rainer
- Comptes Rendus Chimie, Vol. 7, Issue 5, p. 433-461
Effect of local oxygen activity on Ni–BaTiO3 interfacial reactions
journal, August 2006
- Yang, G.; Lee, S.; Liu, Z.
- Acta Materialia, Vol. 54, Issue 13
Sol-gel processing of PZT thin films: A review of the state-of-the-art and process optimization strategies
journal, February 1995
- Schwartz, Robert W.; Boyle, Timothy J.; Lockwood, Steven J.
- Integrated Ferroelectrics, Vol. 7, Issue 1-4
Imprint and oxygen deficiency in (Pb,La)(Zr,Ti)O 3 thin‐film capacitors with La‐Sr‐Co‐O electrodes
journal, March 1995
- Lee, J.; Ramesh, R.; Keramidas, V. G.
- Applied Physics Letters, Vol. 66, Issue 11
Chemical solution deposition of ferroelectric lead lanthanum zirconate titanate films on base-metal foils
journal, January 2008
- Ma, Beihai; Kwon, Do-Kyun; Narayanan, Manoj
- Journal of Electroceramics, Vol. 22, Issue 4, p. 383-389
Solution chemistry effects in Pb(Zr, Ti)O3 thin film processing
journal, November 1992
- Schwartz, R. W.; Bunker, B. C.; Dimos, D. B.
- Integrated Ferroelectrics, Vol. 2, Issue 1-4