Visible light laser voltage probing on thinned substrates
Abstract
The various technologies presented herein relate to utilizing visible light in conjunction with a thinned structure to enable characterization of operation of one or more features included in an integrated circuit (IC). Short wavelength illumination (e.g., visible light) is applied to thinned samples (e.g., ultra-thinned samples) to achieve a spatial resolution for laser voltage probing (LVP) analysis to be performed on smaller technology node silicon-on-insulator (SOI) and bulk devices. Thinning of a semiconductor material included in the IC (e.g., backside material) can be controlled such that the thinned semiconductor material has sufficient thickness to enable operation of one or more features comprising the IC during LVP investigation.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1347574
- Patent Number(s):
- 9599667
- Application Number:
- 14/836,713
- Assignee:
- Sandia Corporation
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Aug 26
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Beutler, Joshua, Clement, John Joseph, Miller, Mary A., Stevens, Jeffrey, and Cole, Jr., Edward I. Visible light laser voltage probing on thinned substrates. United States: N. p., 2017.
Web.
Beutler, Joshua, Clement, John Joseph, Miller, Mary A., Stevens, Jeffrey, & Cole, Jr., Edward I. Visible light laser voltage probing on thinned substrates. United States.
Beutler, Joshua, Clement, John Joseph, Miller, Mary A., Stevens, Jeffrey, and Cole, Jr., Edward I. Tue .
"Visible light laser voltage probing on thinned substrates". United States. https://www.osti.gov/servlets/purl/1347574.
@article{osti_1347574,
title = {Visible light laser voltage probing on thinned substrates},
author = {Beutler, Joshua and Clement, John Joseph and Miller, Mary A. and Stevens, Jeffrey and Cole, Jr., Edward I.},
abstractNote = {The various technologies presented herein relate to utilizing visible light in conjunction with a thinned structure to enable characterization of operation of one or more features included in an integrated circuit (IC). Short wavelength illumination (e.g., visible light) is applied to thinned samples (e.g., ultra-thinned samples) to achieve a spatial resolution for laser voltage probing (LVP) analysis to be performed on smaller technology node silicon-on-insulator (SOI) and bulk devices. Thinning of a semiconductor material included in the IC (e.g., backside material) can be controlled such that the thinned semiconductor material has sufficient thickness to enable operation of one or more features comprising the IC during LVP investigation.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {3}
}
Works referenced in this record:
Fundamentals and future applications of Laser Voltage Probing
conference, June 2014
- Kindereit, Ulrike
- 2014 IEEE International Reliability Physics Symposium (IRPS)