Lateral electrochemical etching of III-nitride materials for microfabrication
Abstract
Conductivity-selective lateral etching of III-nitride materials is described. Methods and structures for making vertical cavity surface emitting lasers with distributed Bragg reflectors via electrochemical etching are described. Layer-selective, lateral electrochemical etching of multi-layer stacks is employed to form semiconductor/air DBR structures adjacent active multiple quantum well regions of the lasers. The electrochemical etching techniques are suitable for high-volume production of lasers and other III-nitride devices, such as lasers, HEMT transistors, power transistors, MEMs structures, and LEDs.
- Inventors:
- Issue Date:
- Research Org.:
- Yale Univ., New Haven, CT (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1345219
- Patent Number(s):
- 9583353
- Application Number:
- 13/923,248
- Assignee:
- Yale University
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- FG02-07ER46387
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Jun 20
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
Citation Formats
Han, Jung. Lateral electrochemical etching of III-nitride materials for microfabrication. United States: N. p., 2017.
Web.
Han, Jung. Lateral electrochemical etching of III-nitride materials for microfabrication. United States.
Han, Jung. Tue .
"Lateral electrochemical etching of III-nitride materials for microfabrication". United States. https://www.osti.gov/servlets/purl/1345219.
@article{osti_1345219,
title = {Lateral electrochemical etching of III-nitride materials for microfabrication},
author = {Han, Jung},
abstractNote = {Conductivity-selective lateral etching of III-nitride materials is described. Methods and structures for making vertical cavity surface emitting lasers with distributed Bragg reflectors via electrochemical etching are described. Layer-selective, lateral electrochemical etching of multi-layer stacks is employed to form semiconductor/air DBR structures adjacent active multiple quantum well regions of the lasers. The electrochemical etching techniques are suitable for high-volume production of lasers and other III-nitride devices, such as lasers, HEMT transistors, power transistors, MEMs structures, and LEDs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {2}
}
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