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Title: Near-chip compliant layer for reducing perimeter stress during assembly process

A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.
Inventors:
; ; ;
Issue Date:
OSTI Identifier:
1343745
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION OSTI
Patent Number(s):
9,570,373
Application Number:
14/963,466
Contract Number:
B604142
Resource Relation:
Patent File Date: 2015 Dec 09
Research Org:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
97 MATHEMATICS AND COMPUTING; 36 MATERIALS SCIENCE

Other works cited in this record:

Circuit arrangement with a cooling member
patent, March 1994

Adjustable thickness thermal interposer and electronic package utilizing same
patent, December 2009

Microelectronic assemblies having compliant layers
patent, January 2011

Microelectronic assemblies having compliant layers
patent, December 2012

Flexible heat sink with lateral compliance
patent, May 2014

Multi-chip socket
patent, July 2014

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