Cooling technique

Salamon, Todd R; Vyas, Brijesh; Kota, Krishna; Simon, Elina

Title: Cooling technique

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Abstract

An apparatus and a method are provided. Use is made of a wick structure configured to receive a liquid and generate vapor in when such wick structure is heated by heat transferred from heat sources to be cooled off. A vapor channel is provided configured to receive the vapor generated and direct said vapor away from the wick structure. In some embodiments, heat conductors are used to transfer the heat from the heat sources to the liquid in the wick structure.

Inventors:: Salamon, Todd R; Vyas, Brijesh; Kota, Krishna; Simon, Elina

Issue Date:: 2017-01-31

Research Org.:: LGS INNOVATIONS LLC Herndon, VA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1341893

Patent Number(s):: 9557118

Application Number:: 13/630,311

Assignee:: LGS INNOVATIONS LLC (Herndon, VA)

Patent Classifications (CPCs):: F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
F28D15/046 - {characterised by the material or the construction of the capillary structure}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
F28D15/0266 - {with separate evaporating and condensing chambers connected by at least one conduit

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L23/427 - Cooling by change of state, e.g. use of heat pipes {

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DOE Contract Number:: EE0002B95

Resource Type:: Patent

Resource Relation:: Patent File Date: 2012 Sep 28

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Salamon, Todd R, Vyas, Brijesh, Kota, Krishna, and Simon, Elina. Cooling technique.  United States: N. p., 2017. 
        Web.

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                    Salamon, Todd R, Vyas, Brijesh, Kota, Krishna, & Simon, Elina. Cooling technique.  United States.

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                    Salamon, Todd R, Vyas, Brijesh, Kota, Krishna, and Simon, Elina. Tue .  
        "Cooling technique".  United States.  https://www.osti.gov/servlets/purl/1341893.

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@article{osti_1341893,

  title        = {Cooling technique},

  author       = {Salamon, Todd R and Vyas, Brijesh and Kota, Krishna and Simon, Elina},

  abstractNote = {An apparatus and a method are provided. Use is made of a wick structure configured to receive a liquid and generate vapor in when such wick structure is heated by heat transferred from heat sources to be cooled off. A vapor channel is provided configured to receive the vapor generated and direct said vapor away from the wick structure. In some embodiments, heat conductors are used to transfer the heat from the heat sources to the liquid in the wick structure.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2017},

  month        = {1}

}

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