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Title: Three-dimensional patterning methods and related devices

Abstract

Three-dimensional patterning methods of a three-dimensional microstructure, such as a semiconductor wire array, are described, in conjunction with etching and/or deposition steps to pattern the three-dimensional microstructure.

Inventors:
; ; ; ; ; ; ;
Issue Date:
Research Org.:
The California Institute of Technology, Pasadena, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1337625
Patent Number(s):
9530912
Application Number:
12/956,422
Assignee:
The California Institute of Technology (Pasadena, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
DOE Contract Number:  
SC0001293; FG02-07ER46405
Resource Type:
Patent
Resource Relation:
Patent File Date: 2010 Nov 30
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Putnam, Morgan C., Kelzenberg, Michael D., Atwater, Harry A., Boettcher, Shannon W., Lewis, Nathan S., Spurgeon, Joshua M., Turner-Evans, Daniel B., and Warren, Emily L.. Three-dimensional patterning methods and related devices. United States: N. p., 2016. Web.
Putnam, Morgan C., Kelzenberg, Michael D., Atwater, Harry A., Boettcher, Shannon W., Lewis, Nathan S., Spurgeon, Joshua M., Turner-Evans, Daniel B., & Warren, Emily L.. Three-dimensional patterning methods and related devices. United States.
Putnam, Morgan C., Kelzenberg, Michael D., Atwater, Harry A., Boettcher, Shannon W., Lewis, Nathan S., Spurgeon, Joshua M., Turner-Evans, Daniel B., and Warren, Emily L.. Tue . "Three-dimensional patterning methods and related devices". United States. https://www.osti.gov/servlets/purl/1337625.
@article{osti_1337625,
title = {Three-dimensional patterning methods and related devices},
author = {Putnam, Morgan C. and Kelzenberg, Michael D. and Atwater, Harry A. and Boettcher, Shannon W. and Lewis, Nathan S. and Spurgeon, Joshua M. and Turner-Evans, Daniel B. and Warren, Emily L.},
abstractNote = {Three-dimensional patterning methods of a three-dimensional microstructure, such as a semiconductor wire array, are described, in conjunction with etching and/or deposition steps to pattern the three-dimensional microstructure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {12}
}

Patent:

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