Provisioning cooling elements for chillerless data centers
Abstract
Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1335654
- Patent Number(s):
- 9,521,787
- Application Number:
- 13/439,433
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012 Apr 04
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 97 MATHEMATICS AND COMPUTING; 42 ENGINEERING
Citation Formats
Chainer, Timothy J., and Parida, Pritish R. Provisioning cooling elements for chillerless data centers. United States: N. p., 2016.
Web.
Chainer, Timothy J., & Parida, Pritish R. Provisioning cooling elements for chillerless data centers. United States.
Chainer, Timothy J., and Parida, Pritish R. Tue .
"Provisioning cooling elements for chillerless data centers". United States. https://www.osti.gov/servlets/purl/1335654.
@article{osti_1335654,
title = {Provisioning cooling elements for chillerless data centers},
author = {Chainer, Timothy J. and Parida, Pritish R.},
abstractNote = {Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {12}
}
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