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Title: Provisioning cooling elements for chillerless data centers

Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
Inventors:
;
Issue Date:
OSTI Identifier:
1335654
Assignee:
International Business Machines Corporation (Armonk, NY) DOEEE
Patent Number(s):
9,521,787
Application Number:
13/439,433
Contract Number:
EE0002894
Resource Relation:
Patent File Date: 2012 Apr 04
Research Org:
International Business Machines Corporation, Armonk, NY (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
97 MATHEMATICS AND COMPUTING; 42 ENGINEERING

Other works cited in this record:

Optimal heat transfer for liquid cooling with minimal coolant volume
conference, May 2011
  • Harrington, Steve
  • 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, p.43-47
  • DOI: 10.1109/STHERM.2011.5767176

TAPO: Thermal-aware power optimization techniques for servers and data centers
conference, September 2011
  • Huang, Wei; Allen-Ware, Malcolm; Carter, John B.
  • 2011 International Green Computing Conference and Workshops, p. 1-8
  • DOI: 10.1109/IGCC.2011.6008610

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