Provisioning cooling elements for chillerless data centers
Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
- Issue Date:
- OSTI Identifier:
- 1335654
- Assignee:
- International Business Machines Corporation (Armonk, NY) DOEEE
- Patent Number(s):
- 9,521,787
- Application Number:
- 13/439,433
- Contract Number:
- EE0002894
- Resource Relation:
- Patent File Date: 2012 Apr 04
- Research Org:
- International Business Machines Corporation, Armonk, NY (United States)
- Sponsoring Org:
- USDOE
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 97 MATHEMATICS AND COMPUTING; 42 ENGINEERING
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Works referenced in this record:
Optimal heat transfer for liquid cooling with minimal coolant volume
conference, May 2011
conference, May 2011
- Harrington, Steve
- 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, p.43-47
TAPO: Thermal-aware power optimization techniques for servers and data centers
conference, September 2011
conference, September 2011
- Huang, Wei; Allen-Ware, Malcolm; Carter, John B.
- 2011 International Green Computing Conference and Workshops, p. 1-8