skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Conformally encapsulated multi-electrode arrays with seamless insulation

Abstract

Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.

Inventors:
; ; ; ; ; ; ;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1333300
Patent Number(s):
9,498,617
Application Number:
13/792,708
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA) LLNL
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Mar 11
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Tabada, Phillipe J., Shah, Kedar G., Tolosa, Vanessa, Pannu, Satinderall S., Tooker, Angela, Delima, Terri, Sheth, Heeral, and Felix, Sarah. Conformally encapsulated multi-electrode arrays with seamless insulation. United States: N. p., 2016. Web.
Tabada, Phillipe J., Shah, Kedar G., Tolosa, Vanessa, Pannu, Satinderall S., Tooker, Angela, Delima, Terri, Sheth, Heeral, & Felix, Sarah. Conformally encapsulated multi-electrode arrays with seamless insulation. United States.
Tabada, Phillipe J., Shah, Kedar G., Tolosa, Vanessa, Pannu, Satinderall S., Tooker, Angela, Delima, Terri, Sheth, Heeral, and Felix, Sarah. Tue . "Conformally encapsulated multi-electrode arrays with seamless insulation". United States. https://www.osti.gov/servlets/purl/1333300.
@article{osti_1333300,
title = {Conformally encapsulated multi-electrode arrays with seamless insulation},
author = {Tabada, Phillipe J. and Shah, Kedar G. and Tolosa, Vanessa and Pannu, Satinderall S. and Tooker, Angela and Delima, Terri and Sheth, Heeral and Felix, Sarah},
abstractNote = {Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {11}
}

Patent:

Save / Share: