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Title: Hermetic electronics package with dual-sided electrical feedthrough configuration

Abstract

A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.

Inventors:
;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1333210
Patent Number(s):
9,504,177
Application Number:
14/118,192
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA) LLNL
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Jun 14
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Shah, Kedar G., and Pannu, Satinderpall S. Hermetic electronics package with dual-sided electrical feedthrough configuration. United States: N. p., 2016. Web.
Shah, Kedar G., & Pannu, Satinderpall S. Hermetic electronics package with dual-sided electrical feedthrough configuration. United States.
Shah, Kedar G., and Pannu, Satinderpall S. Tue . "Hermetic electronics package with dual-sided electrical feedthrough configuration". United States. https://www.osti.gov/servlets/purl/1333210.
@article{osti_1333210,
title = {Hermetic electronics package with dual-sided electrical feedthrough configuration},
author = {Shah, Kedar G. and Pannu, Satinderpall S.},
abstractNote = {A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {11}
}

Patent:

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