Depositing bulk or micro-scale electrodes
Abstract
Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1330715
- Patent Number(s):
- 9485873
- Application Number:
- 14/210,233
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- Patent Classifications (CPCs):
-
A - HUMAN NECESSITIES A61 - MEDICAL OR VETERINARY SCIENCE A61N - ELECTROTHERAPY
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Mar 13
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., and Delima, Terri L. Depositing bulk or micro-scale electrodes. United States: N. p., 2016.
Web.
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., & Delima, Terri L. Depositing bulk or micro-scale electrodes. United States.
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., and Delima, Terri L. Tue .
"Depositing bulk or micro-scale electrodes". United States. https://www.osti.gov/servlets/purl/1330715.
@article{osti_1330715,
title = {Depositing bulk or micro-scale electrodes},
author = {Shah, Kedar G. and Pannu, Satinderpall S. and Tolosa, Vanessa and Tooker, Angela C. and Sheth, Heeral J. and Felix, Sarah H. and Delima, Terri L.},
abstractNote = {Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 01 00:00:00 EDT 2016},
month = {Tue Nov 01 00:00:00 EDT 2016}
}
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Works referenced in this record:
Thermo-Compression Bonding of Metal to Semiconductors and the Like
patent, October 1961
- Anderson, Orson L.; Christenssen, Howard
- US Patent Document 3006067
Implantable Electrodes for the Stimulation of the Sciatic Nerve
patent, June 1973
- Avery, Roger E.; Wersic, James S.
- US Patent Document 3738368
Methods of Bonding Microelectronic Elements
patent-application, October 2002
- Light, David
- US Patent Application 10/093213; 20020142516
Biosensor
patent-application, July 2004
- Choi, Moon-Hee; Cui, Gang; Yoo, Jae-Hyun
- US Patent Application 10/476634; 20040140209
Insulated Implantable Electrical Circuit
patent-application, October 2006
- Greenberg, Robert; Talbot, Neil Hamilton; Ok, Jerry
- US Patent Application 11/441993; 20060225274
Analyte Sensor and Fabrication Methods
patent-application, August 2010
- Petisce, James R.; Zhou, David; Valiket, Mena
- US Patent Application 12/699302; 20100200538
Ink Jet Printing of Implantable Electrodes
patent-application, December 2010
- Jolly, Claude; Nielsen, Stefan B.
- US Patent Application 12/787866; 20100305673
Rigid Spine Reinforced Polymer Microelectrode Array Probe and Method of Fabrication
patent-application, December 2010
- Tabada, Phillipe; Pannu, Satinderpall S.
- US Patent Application 12/772895; 20100331935
Wound Dressing with Impedance Sensor
patent-application, July 2012
- Connolly, Patricia P.
- US Patent Application 13/379309; 20120190956
Removable silicon insertion stiffeners for neural probes using polyethylene glycol as a biodissolvable adhesive
conference, August 2012
- Felix, S.; Shah, K.; George, D.
- 2012 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society
Improved chronic neural stimulation using high surface area platinum electrodes
conference, July 2013
- Shah, Kedar G.; Tolosa, Vanessa M.; Tooker, Angela C.
- 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)