Depositing bulk or micro-scale electrodes
Abstract
Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1330715
- Patent Number(s):
- 9485873
- Application Number:
- 14/210,233
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- Patent Classifications (CPCs):
-
A - HUMAN NECESSITIES A61 - MEDICAL OR VETERINARY SCIENCE A61N - ELECTROTHERAPY
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Mar 13
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., and Delima, Terri L.. Depositing bulk or micro-scale electrodes. United States: N. p., 2016.
Web.
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., & Delima, Terri L.. Depositing bulk or micro-scale electrodes. United States.
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., and Delima, Terri L.. Tue .
"Depositing bulk or micro-scale electrodes". United States. https://www.osti.gov/servlets/purl/1330715.
@article{osti_1330715,
title = {Depositing bulk or micro-scale electrodes},
author = {Shah, Kedar G. and Pannu, Satinderpall S. and Tolosa, Vanessa and Tooker, Angela C. and Sheth, Heeral J. and Felix, Sarah H. and Delima, Terri L.},
abstractNote = {Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {11}
}
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