Depositing bulk or micro-scale electrodes
Abstract
Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1330715
- Patent Number(s):
- 9,485,873
- Application Number:
- 14/210,233
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Mar 13
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., and Delima, Terri L. Depositing bulk or micro-scale electrodes. United States: N. p., 2016.
Web.
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., & Delima, Terri L. Depositing bulk or micro-scale electrodes. United States.
Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., and Delima, Terri L. Tue .
"Depositing bulk or micro-scale electrodes". United States. https://www.osti.gov/servlets/purl/1330715.
@article{osti_1330715,
title = {Depositing bulk or micro-scale electrodes},
author = {Shah, Kedar G. and Pannu, Satinderpall S. and Tolosa, Vanessa and Tooker, Angela C. and Sheth, Heeral J. and Felix, Sarah H. and Delima, Terri L.},
abstractNote = {Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {11}
}
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Works referenced in this record:
Removable silicon insertion stiffeners for neural probes using polyethylene glycol as a biodissolvable adhesive
conference, August 2012
- Felix, S.; Shah, K.; George, D.
- 2012 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society
Improved chronic neural stimulation using high surface area platinum electrodes
conference, July 2013
- Shah, Kedar G.; Tolosa, Vanessa M.; Tooker, Angela C.
- 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)