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Title: Probe tip heating assembly

A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.
Inventors:
;
Issue Date:
OSTI Identifier:
1330349
Assignee:
Hysitron, Inc. (Eden Prairie, MN) CHO
Patent Number(s):
9,476,816
Application Number:
14/358,065
Contract Number:
FG02-07ER84812
Resource Relation:
Patent File Date: 2012 Nov 14
Research Org:
Hysitron, Inc., Eden Prairie, MN (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING
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Works referenced in this record:

Direct Observation of Vapor−Liquid−Solid Nanowire Growth
journal, April 2001
  • Wu, Yiying; Yang, Peidong
  • Journal of the American Chemical Society, Vol. 123, Issue 13, p. 3165-3166
  • DOI: 10.1021/ja0059084

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