Title: Probe tip heating assembly

Abstract

A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.

Inventors:

Schmitz, Roger William; Oh, Yunje

Issue Date:

Tue Oct 25 00:00:00 EDT 2016

Research Org.:

Hysitron, Inc., Eden Prairie, MN (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1330349

Patent Number(s):

9476816

Application Number:

14/358,065

Assignee:

Hysitron, Inc. (Eden Prairie, MN)

Patent Classifications (CPCs):

G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES

G - PHYSICS G01 - MEASURING G01Q - SCANNING-PROBE TECHNIQUES OR APPARATUS

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G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES

G01N2203/0226 - High temperature
G01N2203/0282 - Two dimensional, e.g. tapes, webs, sheets, strips, disks or membranes
G01N3/40 - Investigating hardness or rebound hardness
G01N3/42 - by performing impressions under a steady load by indentors, e.g. sphere, pyramid

G - PHYSICS G01 - MEASURING G01Q - SCANNING-PROBE TECHNIQUES OR APPARATUS

G01Q30/02 - Non-SPM analysing devices, e.g. SEM [Scanning Electron Microscope], spectrometer or optical microscope
G01Q30/10 - Thermal environment
G01Q60/366 - {Nanoindenters, i.e. wherein the indenting force is measured}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING

H05B3/03 - Electrodes

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DOE Contract Number:  

FG02-07ER84812

Resource Type:

Patent

Resource Relation:

Patent File Date: 2012 Nov 14

Country of Publication:

United States

Language:

English

Subject:

42 ENGINEERING