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Title: Liquid cooled data center design selection

Abstract

Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.

Inventors:
; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1324400
Patent Number(s):
9445529
Application Number:
13/479,265
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 May 23
Country of Publication:
United States
Language:
English
Subject:
97 MATHEMATICS AND COMPUTING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION

Citation Formats

Chainer, Timothy J., Iyengar, Madhusudan K., and Parida, Pritish R. Liquid cooled data center design selection. United States: N. p., 2016. Web.
Chainer, Timothy J., Iyengar, Madhusudan K., & Parida, Pritish R. Liquid cooled data center design selection. United States.
Chainer, Timothy J., Iyengar, Madhusudan K., and Parida, Pritish R. Tue . "Liquid cooled data center design selection". United States. https://www.osti.gov/servlets/purl/1324400.
@article{osti_1324400,
title = {Liquid cooled data center design selection},
author = {Chainer, Timothy J. and Iyengar, Madhusudan K. and Parida, Pritish R.},
abstractNote = {Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {9}
}

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Works referenced in this record:

From chip to cooling tower data center modeling: Part I Influence of server inlet temperature and temperature rise across cabinet
conference, June 2010


Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems
journal, April 2009


Hybrid cooled data center using above ambient liquid cooling
conference, June 2010


Profiling Sustainability of Data Centers
conference, May 2010

  • Gmach, Daniel; Shah, Amip
  • 2010 IEEE International Symposium on Sustainable Systems and Technology (ISSST), Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology
  • https://doi.org/10.1109/ISSST.2010.5507750