Solar cell array interconnects
Abstract
Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.
- Inventors:
- Issue Date:
- Research Org.:
- University of California
- OSTI Identifier:
- 131897
- Patent Number(s):
- 5,466,302
- Application Number:
- PAN: 8-239,866
- Assignee:
- Univ. of California, Oakland, CA (United States)
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Resource Relation:
- Other Information: PBD: 14 Nov 1995
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 14 SOLAR ENERGY; SOLAR CELLS; CONNECTORS; DESIGN; PERFORMANCE; METALLURGICAL FLUX; SOLDERED JOINTS; SILICONES; ELECTRIC CONDUCTIVITY
Citation Formats
Carey, P G, Thompson, J B, Colella, N J, and Williams, K A. Solar cell array interconnects. United States: N. p., 1995.
Web.
Carey, P G, Thompson, J B, Colella, N J, & Williams, K A. Solar cell array interconnects. United States.
Carey, P G, Thompson, J B, Colella, N J, and Williams, K A. Tue .
"Solar cell array interconnects". United States.
@article{osti_131897,
title = {Solar cell array interconnects},
author = {Carey, P G and Thompson, J B and Colella, N J and Williams, K A},
abstractNote = {Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {11}
}