Solar cell array interconnects
Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.
- Issue Date:
- OSTI Identifier:
- 131897
- Assignee:
- Univ. of California, Oakland, CA (United States) PTO; SCA: 140501; PA: EDB-95:154591; SN: 95001485788
- Patent Number(s):
- US 5,466,302/A/
- Application Number:
- PAN: 8-239,866
- Contract Number:
- W-7405-ENG-48
- Resource Relation:
- Other Information: PBD: 14 Nov 1995
- Research Org:
- University of California
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 14 SOLAR ENERGY; SOLAR CELLS; CONNECTORS; DESIGN; PERFORMANCE; METALLURGICAL FLUX; SOLDERED JOINTS; SILICONES; ELECTRIC CONDUCTIVITY