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Title: Solar cell array interconnects

Abstract

Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.

Inventors:
; ; ;
Issue Date:
Research Org.:
University of California
OSTI Identifier:
131897
Patent Number(s):
5,466,302
Application Number:
PAN: 8-239,866
Assignee:
Univ. of California, Oakland, CA (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 14 Nov 1995
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY; SOLAR CELLS; CONNECTORS; DESIGN; PERFORMANCE; METALLURGICAL FLUX; SOLDERED JOINTS; SILICONES; ELECTRIC CONDUCTIVITY

Citation Formats

Carey, P G, Thompson, J B, Colella, N J, and Williams, K A. Solar cell array interconnects. United States: N. p., 1995. Web.
Carey, P G, Thompson, J B, Colella, N J, & Williams, K A. Solar cell array interconnects. United States.
Carey, P G, Thompson, J B, Colella, N J, and Williams, K A. Tue . "Solar cell array interconnects". United States.
@article{osti_131897,
title = {Solar cell array interconnects},
author = {Carey, P G and Thompson, J B and Colella, N J and Williams, K A},
abstractNote = {Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {11}
}