Low profile, highly configurable, current sharing paralleled wide band gap power device power module
Abstract
A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.
- Inventors:
- Issue Date:
- Research Org.:
- Cree Fayetteville, Inc. Fayetteville, AR (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1303252
- Patent Number(s):
- 9426883
- Application Number:
- 14/609,629
- Assignee:
- Cree Fayetteville, Inc. (Fayetteville, AR)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- EE0006429
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Jan 30
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 24 POWER TRANSMISSION AND DISTRIBUTION
Citation Formats
McPherson, Brice, Killeen, Peter D., Lostetter, Alex, Shaw, Robert, Passmore, Brandon, Hornberger, Jared, and Berry, Tony M. Low profile, highly configurable, current sharing paralleled wide band gap power device power module. United States: N. p., 2016.
Web.
McPherson, Brice, Killeen, Peter D., Lostetter, Alex, Shaw, Robert, Passmore, Brandon, Hornberger, Jared, & Berry, Tony M. Low profile, highly configurable, current sharing paralleled wide band gap power device power module. United States.
McPherson, Brice, Killeen, Peter D., Lostetter, Alex, Shaw, Robert, Passmore, Brandon, Hornberger, Jared, and Berry, Tony M. Tue .
"Low profile, highly configurable, current sharing paralleled wide band gap power device power module". United States. https://www.osti.gov/servlets/purl/1303252.
@article{osti_1303252,
title = {Low profile, highly configurable, current sharing paralleled wide band gap power device power module},
author = {McPherson, Brice and Killeen, Peter D. and Lostetter, Alex and Shaw, Robert and Passmore, Brandon and Hornberger, Jared and Berry, Tony M},
abstractNote = {A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 23 00:00:00 EDT 2016},
month = {Tue Aug 23 00:00:00 EDT 2016}
}
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Works referenced in this record:
Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die
patent, October 2001
- Williams, Richard K.; Lam, Allen K.; Choi, Alexander
- US Patent Document 6,307,755
Power module and method of fabricating the same
patent, March 2010
- Son, Joon-seo; Lim, Seung-won; Jeon, O-seob
- US Patent Document 7,687,903
Double-sided package for power module
patent, August 2010
- Casey, Leo Francis; Borowy, Bogdan S.; Davis, Gregg Herbert
- US Patent Document 7,786,486
Package for high power density devices
patent, September 2011
- Hauenstein, Henning M.
- US Patent Document 8,018,056
Wafer scale package for high power devices
patent, February 2013
- Hauenstein, Henning M.
- US Patent Document 8,368,210