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Title: System and method for interfacing large-area electronics with integrated circuit devices

Abstract

A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.

Inventors:
; ; ;
Issue Date:
Research Org.:
The Trustees of Princeton University, Princeton, NJ (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1261601
Patent Number(s):
9,391,220
Application Number:
13/367,856
Assignee:
The Trustees of Princeton University (Princeton, NJ)
DOE Contract Number:  
EE0004261
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Feb 07
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Verma, Naveen, Glisic, Branko, Sturm, James, and Wagner, Sigurd. System and method for interfacing large-area electronics with integrated circuit devices. United States: N. p., 2016. Web.
Verma, Naveen, Glisic, Branko, Sturm, James, & Wagner, Sigurd. System and method for interfacing large-area electronics with integrated circuit devices. United States.
Verma, Naveen, Glisic, Branko, Sturm, James, and Wagner, Sigurd. Tue . "System and method for interfacing large-area electronics with integrated circuit devices". United States. https://www.osti.gov/servlets/purl/1261601.
@article{osti_1261601,
title = {System and method for interfacing large-area electronics with integrated circuit devices},
author = {Verma, Naveen and Glisic, Branko and Sturm, James and Wagner, Sigurd},
abstractNote = {A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {7}
}

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