System and method for interfacing large-area electronics with integrated circuit devices

Verma, Naveen; Glisic, Branko; Sturm, James; Wagner, Sigurd

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Title: System and method for interfacing large-area electronics with integrated circuit devices

Abstract

A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.

Inventors:: Verma, Naveen; Glisic, Branko; Sturm, James; Wagner, Sigurd

Issue Date:: 2016-07-12

Research Org.:: Princeton Univ., NJ (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1261601

Patent Number(s):: 9391220

Application Number:: 13/367,856

Assignee:: The Trustees of Princeton University (Princeton, NJ)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L31/03926 - {comprising a flexible substrate}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
Y02E10/50 - Photovoltaic [PV] energy

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/49124 - On flat or curved insulated base, e.g., printed circuit, etc.

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DOE Contract Number:: EE0004261

Resource Type:: Patent

Resource Relation:: Patent File Date: 2012 Feb 07

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Verma, Naveen, Glisic, Branko, Sturm, James, and Wagner, Sigurd. System and method for interfacing large-area electronics with integrated circuit devices.  United States: N. p., 2016. 
        Web.

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                    Verma, Naveen, Glisic, Branko, Sturm, James, & Wagner, Sigurd. System and method for interfacing large-area electronics with integrated circuit devices.  United States.

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                    Verma, Naveen, Glisic, Branko, Sturm, James, and Wagner, Sigurd. Tue .  
        "System and method for interfacing large-area electronics with integrated circuit devices".  United States.  https://www.osti.gov/servlets/purl/1261601.

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@article{osti_1261601,

  title        = {System and method for interfacing large-area electronics with integrated circuit devices},

  author       = {Verma, Naveen and Glisic, Branko and Sturm, James and Wagner, Sigurd},

  abstractNote = {A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2016},

  month        = {7}

}

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Similar Records

Title: System and method for interfacing large-area electronics with integrated circuit devices

Abstract

Citation Formats

Health Monitoring of Civil Infrastructures Using Wireless Sensor Networks conference, April 2007

Photonic crystals for monitoring fatigue phenomena in steel structures conference, March 2009

Elastically Tunable Self-Organized Organic Lasers journal, January 2011

Materials and Applications for Large Area Electronics: Solution-Based Approaches journal, January 2010

A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications journal, June 2004

Organic Semiconductor Devices with Enhanced Field and Environmental Responses for Novel Applications journal, July 2008

Electroluminescent flexible film for product packaging patent, October 2003

Scan testing system for circuits under test patent, June 2010

Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites patent-application, June 2004

Large-area nanoenabled macroelectronic substrates and uses therefor patent-application, April 2005

Deformable organic devices patent-application, August 2006

Health Monitoring of Civil Infrastructures Using Wireless Sensor Networks
conference, April 2007

Photonic crystals for monitoring fatigue phenomena in steel structures
conference, March 2009

Elastically Tunable Self-Organized Organic Lasers
journal, January 2011

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journal, January 2010

A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications
journal, June 2004

Organic Semiconductor Devices with Enhanced Field and Environmental Responses for Novel Applications
journal, July 2008

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patent, June 2010

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patent-application, June 2004

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