Silicon force sensor
Abstract
The various technologies presented herein relate to a sensor for measurement of high forces and/or high load shock rate(s), whereby the sensor utilizes silicon as the sensing element. A plate of Si can have a thinned region formed therein on which can be formed a number of traces operating as a Wheatstone bridge. The brittle Si can be incorporated into a layered structure comprising ductile and/or compliant materials. The sensor can have a washer-like configuration which can be incorporated into a nut and bolt configuration, whereby tightening of the nut and bolt can facilitate application of a compressive preload upon the sensor. Upon application of an impact load on the bolt, the compressive load on the sensor can be reduced (e.g., moves towards zero-load), however the magnitude of the preload can be such that the load on the sensor does not translate to tensile stress being applied to the sensor.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1260241
- Patent Number(s):
- 9383270
- Application Number:
- 14/064,573
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01L - MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Oct 28
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 36 MATERIALS SCIENCE
Citation Formats
Galambos, Paul C., Crenshaw, Thomas B., Nishida, Erik E., Burnett, Damon J., and Lantz, Jeffrey W. Silicon force sensor. United States: N. p., 2016.
Web.
Galambos, Paul C., Crenshaw, Thomas B., Nishida, Erik E., Burnett, Damon J., & Lantz, Jeffrey W. Silicon force sensor. United States.
Galambos, Paul C., Crenshaw, Thomas B., Nishida, Erik E., Burnett, Damon J., and Lantz, Jeffrey W. Tue .
"Silicon force sensor". United States. https://www.osti.gov/servlets/purl/1260241.
@article{osti_1260241,
title = {Silicon force sensor},
author = {Galambos, Paul C. and Crenshaw, Thomas B. and Nishida, Erik E. and Burnett, Damon J. and Lantz, Jeffrey W.},
abstractNote = {The various technologies presented herein relate to a sensor for measurement of high forces and/or high load shock rate(s), whereby the sensor utilizes silicon as the sensing element. A plate of Si can have a thinned region formed therein on which can be formed a number of traces operating as a Wheatstone bridge. The brittle Si can be incorporated into a layered structure comprising ductile and/or compliant materials. The sensor can have a washer-like configuration which can be incorporated into a nut and bolt configuration, whereby tightening of the nut and bolt can facilitate application of a compressive preload upon the sensor. Upon application of an impact load on the bolt, the compressive load on the sensor can be reduced (e.g., moves towards zero-load), however the magnitude of the preload can be such that the load on the sensor does not translate to tensile stress being applied to the sensor.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {7}
}
Works referenced in this record:
Mechanical characterization in failure strength of silicon dice
conference, January 2004
- Chong, D. Y. R.; Lee, W. E.; Lim, B. K.
- The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)