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Title: LED module with high index lens

Abstract

An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
LUMILEDS LLC, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1260215
Patent Number(s):
9385285
Application Number:
12/561,617
Assignee:
LUMILEDS LLC (San Jose, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
FC26-08NT01583
Resource Type:
Patent
Resource Relation:
Patent File Date: 2009 Sep 17
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, and Wei, Yajun. LED module with high index lens. United States: N. p., 2016. Web.
Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, & Wei, Yajun. LED module with high index lens. United States.
Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, and Wei, Yajun. Tue . "LED module with high index lens". United States. https://www.osti.gov/servlets/purl/1260215.
@article{osti_1260215,
title = {LED module with high index lens},
author = {Bierhuizen, Serge J. and Wang, Nanze Patrick and Eng, Gregory W. and Sun, Decai and Wei, Yajun},
abstractNote = {An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {7}
}

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Luminescent ceramic for a light emitting device
patent, April 2008


LED package having an array of light emitting cells coupled in series
patent, December 2013


Light source device using led, and method of producing same
patent-application, October 2003


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patent-application, March 2004


Semiconductor light-emitting device
patent-application, March 2005


Composite heat conductive structure for a LED package
patent-application, March 2006


LED housing and fabrication method thereof
patent-application, August 2006


Light emitting device
patent-application, April 2007


Light-Emitting Device and Illuminating Apparatus
patent-application, February 2008


Lighting Device Package
patent-application, March 2008


Method of Making a Light Emitting Device Having a Molded Encapsulant
patent-application, April 2008


Molded Lens Incorporating a Window Element
patent-application, March 2011