Title: Monolithic LTCC seal frame and lid

Abstract

A method for forming a monolithic seal frame and lid for use with a substrate and electronic circuitry comprises the steps of forming a mandrel from a ceramic and glass based material, forming a seal frame and lid block from a ceramic and glass based material, creating a seal frame and lid by forming a compartment and a plurality of sidewalls in the seal frame and lid block, placing the seal frame and lid on the mandrel such that the mandrel fits within the compartment, and cofiring the seal frame and lid block.

Inventors:

Krueger, Daniel S.; Peterson, Kenneth A.; Stockdale, Dave; Duncan, James Brent; Riggs, Bristen

Issue Date:

2016-06-21

Research Org.:

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1257979

Patent Number(s):

9374923

Application Number:

14/091,578

Assignee:

Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)

Patent Classifications (CPCs):

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K13/0015 - {Orientation
H05K5/066 - {sealed by fusion of the joining parts without bringing material
H05K5/069 - {Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K5/03 - Covers

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L23/552 - Protection against radiation, e.g. light {or electromagnetic waves}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K5/0091 - {Housing specially adapted for small components

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K5/0095 - {hermetically-sealed}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L23/12 - Mountings, e.g. non-detachable insulating substrates
H01L23/10 - characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K5/0004 - {comprising several parts forming a closed casing}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, {e.g. sealing of a cap to a base of a container}

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DOE Contract Number:  

AC04-94AL85000; NA0000622

Resource Type:

Patent

Resource Relation:

Patent File Date: 2013 Nov 27

Country of Publication:

United States

Language:

English

Subject:

36 MATERIALS SCIENCE; 42 ENGINEERING