Cooling apparatus with a resilient heat conducting member

Chainer, Timothy J.; Parida, Pritish R.; Schultz, Mark D.

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
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A24 - tobacco
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B - performing operations
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B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
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Title: Cooling apparatus with a resilient heat conducting member

Abstract

A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.

Inventors:: Chainer, Timothy J.; Parida, Pritish R.; Schultz, Mark D.

Issue Date:: 2016-06-14

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1257183

Patent Number(s):: 9370122

Application Number:: 13/738,961

Assignee:: INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)

Patent Classifications (CPCs):: G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

Show more

G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING
G06F1/20 - Cooling means
G06F2203/04108 - Touchless 2D- digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface without distance measurement in the Z direction
G06F2203/04805 - Virtual magnifying lens, i.e. window or frame movable on top of displayed information to enlarge it for better reading or selection
G06F3/044 - by capacitive means

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K7/20009 - {using a gaseous coolant in electronic enclosures
H05K7/20772 - {within server blades for removing heat from heat source}

Show less

DOE Contract Number:: EE0002894

Resource Type:: Patent

Resource Relation:: Patent File Date: 2013 Jan 10

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D.. Cooling apparatus with a resilient heat conducting member.  United States: N. p., 2016. 
        Web.

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                    Chainer, Timothy J., Parida, Pritish R., & Schultz, Mark D.. Cooling apparatus with a resilient heat conducting member.  United States.

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                    Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D.. Tue .  
        "Cooling apparatus with a resilient heat conducting member".  United States.  https://www.osti.gov/servlets/purl/1257183.

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@article{osti_1257183,

  title        = {Cooling apparatus with a resilient heat conducting member},

  author       = {Chainer, Timothy J. and Parida, Pritish R. and Schultz, Mark D.},

  abstractNote = {A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2016},

  month        = {6}

}

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Title: Cooling apparatus with a resilient heat conducting member

Abstract

Citation Formats

Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers conference, March 2012

Server liquid cooling with chiller-less data center design to enable significant energy savings conference, March 2012

Unitary heat-dissipating fin strip unit with straight strip portions and U-shaped strip portions patent, September 2002

Heat dissipating device for dissipating heat generated by a disk drive module inside a computer housing patent, May 2004

Memory heat-dissipating device patent, May 2007

Compliant thermal interface structure with vapor chamber patent, September 2007

Compliant thermal interface structure utilizing spring elements patent, April 2008

Cooling structure using rigid movable elements patent, April 2008

Display module patent, April 2008

Hybrid cooling system for a multi-component electronics system patent, July 2008

Compliant thermal interface structure utilizing spring elements with fins patent, August 2008

Compliant thermal interface structure utilizing spring elements patent, June 2009

Cooling structure using rigid movable elements patent, June 2009

Conductive heat transport cooling system and method for a multi-component electronics system patent, December 2009

Heat transfer mechanism, heat dissipation system, and communication apparatus patent, February 2010

Liquid cooling system patent, March 2011

Fin-type heat sink and electronic device using same patent, March 2011

High performance dual-in-line memory (DIMM) array liquid cooling assembly and method patent, June 2011

Heat sink and electronic device using same patent, August 2011

Heat radiator patent, August 2011

Liquid-cooled electronics apparatus and methods of fabrication patent, September 2011

Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages patent, December 2011

Printed circuit board cooling assembly patent, December 2013

Liquid-cooled memory system having one cooling pipe per pair of DIMMs patent, February 2014

Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) patent, December 2014

Liquid DIMM Cooler patent-application, November 2006

Heat dissipating assembly patent-application, June 2007

Folded-Sheet-Metal Heatsinks for Closely Packaged Heat-Producing Devices patent-application, May 2008

Conductive Heat Transport Cooling System and Method for a Multi-Component Electronics System patent-application, October 2008

Liquid-Cooled Electronics Apparatus And Methods Of Fabrication patent-application, March 2011

Liquid DIMM Cooling Device patent-application, January 2013

Method, Apparatus, and System for Dissipating Heat of Memory with Liquid Cooling patent-application, December 2013

Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers
conference, March 2012

Server liquid cooling with chiller-less data center design to enable significant energy savings
conference, March 2012

Unitary heat-dissipating fin strip unit with straight strip portions and U-shaped strip portions
patent, September 2002

Heat dissipating device for dissipating heat generated by a disk drive module inside a computer housing
patent, May 2004

Memory heat-dissipating device
patent, May 2007

Compliant thermal interface structure with vapor chamber
patent, September 2007

Compliant thermal interface structure utilizing spring elements
patent, April 2008

Cooling structure using rigid movable elements
patent, April 2008

Display module
patent, April 2008

Hybrid cooling system for a multi-component electronics system
patent, July 2008

Compliant thermal interface structure utilizing spring elements with fins
patent, August 2008

Compliant thermal interface structure utilizing spring elements
patent, June 2009

Cooling structure using rigid movable elements
patent, June 2009

Conductive heat transport cooling system and method for a multi-component electronics system
patent, December 2009

Heat transfer mechanism, heat dissipation system, and communication apparatus
patent, February 2010

Liquid cooling system
patent, March 2011

Fin-type heat sink and electronic device using same
patent, March 2011

High performance dual-in-line memory (DIMM) array liquid cooling assembly and method
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Heat sink and electronic device using same
patent, August 2011

Heat radiator
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Liquid-cooled electronics apparatus and methods of fabrication
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Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages
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Printed circuit board cooling assembly
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Liquid-cooled memory system having one cooling pipe per pair of DIMMs
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Liquid DIMM Cooler
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