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Title: Cooling apparatus with a resilient heat conducting member

Abstract

A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.

Inventors:
; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1257183
Patent Number(s):
9,370,122
Application Number:
13/738,961
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Jan 10
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D. Cooling apparatus with a resilient heat conducting member. United States: N. p., 2016. Web.
Chainer, Timothy J., Parida, Pritish R., & Schultz, Mark D. Cooling apparatus with a resilient heat conducting member. United States.
Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D. Tue . "Cooling apparatus with a resilient heat conducting member". United States. https://www.osti.gov/servlets/purl/1257183.
@article{osti_1257183,
title = {Cooling apparatus with a resilient heat conducting member},
author = {Chainer, Timothy J. and Parida, Pritish R. and Schultz, Mark D.},
abstractNote = {A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {6}
}

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Works referenced in this record:

Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers
conference, March 2012

  • David, Milnes P.; Iyengar, Madhusudan; Parida, Pritish
  • 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
  • DOI: 10.1109/STHERM.2012.6188853

Server liquid cooling with chiller-less data center design to enable significant energy savings
conference, March 2012

  • Iyengar, Madhusudan; David, Milnes; Parida, Pritish
  • 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
  • DOI: 10.1109/STHERM.2012.6188851