Architecture and method for a burst buffer using flash technology

Title: Architecture and method for a burst buffer using flash technology

A parallel supercomputing cluster includes compute nodes interconnected in a mesh of data links for executing an MPI job, and solid-state storage nodes each linked to a respective group of the compute nodes for receiving checkpoint data from the respective compute nodes, and magnetic disk storage linked to each of the solid-state storage nodes for asynchronous migration of the checkpoint data from the solid-state storage nodes to the magnetic disk storage. Each solid-state storage node presents a file system interface to the MPI job, and multiple MPI processes of the MPI job write the checkpoint data to a shared file in the solid-state storage in a strided fashion, and the solid-state storage node asynchronously migrates the checkpoint data from the shared file in the solid-state storage to the magnetic disk storage and writes the checkpoint data to the magnetic disk storage in a sequential fashion.

Inventors:: Tzelnic, Percy; Faibish, Sorin; Gupta, Uday K.; Bent, John; Grider, Gary Alan; Chen, Hsing-bung

Issue Date:: 2016-03-15

OSTI Identifier:: 1243041

Assignee:: EMC Corporation (Hopkinton, MA) Los Alamos National Security, LLC (Los Alamos, NM) LANL

Patent Number(s):: 9,286,261

Application Number:: 13/676,000

Contract Number:: AC52-06NA25396

Resource Relation:: Patent File Date: 2012 Nov 13

Research Org:: Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

Sponsoring Org:: USDOE

Country of Publication:: United States

Language:: English

Subject:: 97 MATHEMATICS AND COMPUTING

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Works referenced in this record:

DASH-IO: an empirical study of flash-based IO for HPC
conference, January 2010

He, Jiahua; Bennett, Jeffrey; Snavely, Allan
Proceedings of the 2010 TeraGrid Conference on - TG '10, Article No. 10
DOI: 10.1145/1838574.1838584

PLFS: a checkpoint filesystem for parallel applications
conference, January 2009

Bent, John; Gibson, Garth; Grider, Gary
DOI: 10.1145/1654059.1654081

A comprehensive study of energy efficiency and performance of flash-based SSD
journal, April 2011

Park, Seonyeong; Kim, Youngjae; Urgaonkar, Bhuvan
Journal of Systems Architecture, Vol. 57, Issue 4, p. 354-365
DOI: 10.1016/j.sysarc.2011.01.005

Storage challenges at Los Alamos National Lab
conference, April 2012

Bent, John; Grider, Gary; Kettering, Brett
DOI: 10.1109/MSST.2012.6232376

A higher order estimate of the optimum checkpoint interval for restart dumps
journal, February 2006

Daly, J. T.
Future Generation Computer Systems, Vol. 22, Issue 3, p. 303-312
DOI: 10.1016/j.future.2004.11.016

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