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Title: Low-melting elemental metal or fusible alloy encapsulated polymerization initiator for delayed initiation

An encapsulated composition for polymerization includes an initiator composition for initiating a polymerization reaction, and a capsule prepared from an elemental metal or fusible alloy having a melting temperature from about 20.degree. C. to about 200.degree. C. A fluid for polymerization includes the encapsulated composition and a monomer. When the capsule melts or breaks open, the initiator is released.
Inventors:
Issue Date:
OSTI Identifier:
1233362
Assignee:
LOS ALAMOS NATIONAL SECURITY, LLC LANL
Patent Number(s):
9,217,101
Application Number:
13/081,935
Contract Number:
AC52-06NA25396
Resource Relation:
Patent File Date: 2011 Apr 07
Research Org:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

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Well Packer
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Preapplied plastic film adhesive composition
patent, November 1983

MICR processes with colored encapsulated compositions
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