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Title: Induction soldering of photovoltaic system components

Abstract

A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

Inventors:
;
Issue Date:
Research Org.:
SunPower Corporation, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1226546
Patent Number(s):
9,186,741
Application Number:
12/558,095
Assignee:
SunPower Corporation (San Jose, CA)
DOE Contract Number:  
FC36-07GO17043
Resource Type:
Patent
Resource Relation:
Patent File Date: 2009 Sep 11
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY

Citation Formats

Kumaria, Shashwat, and de Leon, Briccio. Induction soldering of photovoltaic system components. United States: N. p., 2015. Web.
Kumaria, Shashwat, & de Leon, Briccio. Induction soldering of photovoltaic system components. United States.
Kumaria, Shashwat, and de Leon, Briccio. Tue . "Induction soldering of photovoltaic system components". United States. https://www.osti.gov/servlets/purl/1226546.
@article{osti_1226546,
title = {Induction soldering of photovoltaic system components},
author = {Kumaria, Shashwat and de Leon, Briccio},
abstractNote = {A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {11}
}

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