Thin film electronic devices with conductive and transparent gas and moisture permeation barriers
Abstract
Thin film electronic devices (or stacks integrated with a substrate) that include a permeation barrier formed of a thin layer of metal that provides a light transmitting and electrically conductive layer, wherein the electrical conductive layer is formed on a surface of the substrate or device layer such as a transparent conducting material layer with pin holes or defects caused by manufacturing and the thin layer of metal is deposited on the conductive layer and formed from a self-healing metal that forms self-terminating oxides. A permeation plug or block is formed in or adjacent to the thin film of metal at or proximate to the pin holes to block further permeation of contaminants through the pin holes.
- Inventors:
- Issue Date:
- Research Org.:
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1202314
- Patent Number(s):
- 9,093,661
- Application Number:
- 14/077,544
- Assignee:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- DOE Contract Number:
- AC36-08GO28308
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Nov 12
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
Citation Formats
Simpson, Lin Jay. Thin film electronic devices with conductive and transparent gas and moisture permeation barriers. United States: N. p., 2015.
Web.
Simpson, Lin Jay. Thin film electronic devices with conductive and transparent gas and moisture permeation barriers. United States.
Simpson, Lin Jay. Tue .
"Thin film electronic devices with conductive and transparent gas and moisture permeation barriers". United States. https://www.osti.gov/servlets/purl/1202314.
@article{osti_1202314,
title = {Thin film electronic devices with conductive and transparent gas and moisture permeation barriers},
author = {Simpson, Lin Jay},
abstractNote = {Thin film electronic devices (or stacks integrated with a substrate) that include a permeation barrier formed of a thin layer of metal that provides a light transmitting and electrically conductive layer, wherein the electrical conductive layer is formed on a surface of the substrate or device layer such as a transparent conducting material layer with pin holes or defects caused by manufacturing and the thin layer of metal is deposited on the conductive layer and formed from a self-healing metal that forms self-terminating oxides. A permeation plug or block is formed in or adjacent to the thin film of metal at or proximate to the pin holes to block further permeation of contaminants through the pin holes.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {7}
}
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