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Title: Apparatus for the compact cooling of modules

Abstract

An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.

Inventors:
;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1190908
Patent Number(s):
9,076,753
Application Number:
13/475,348
Assignee:
International Business Machines Corporation (Armonk, NY)
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 May 18
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 97 MATHEMATICS AND COMPUTING

Citation Formats

Iyengar, Madhusudan K., and Parida, Pritish R. Apparatus for the compact cooling of modules. United States: N. p., 2015. Web.
Iyengar, Madhusudan K., & Parida, Pritish R. Apparatus for the compact cooling of modules. United States.
Iyengar, Madhusudan K., and Parida, Pritish R. Tue . "Apparatus for the compact cooling of modules". United States. https://www.osti.gov/servlets/purl/1190908.
@article{osti_1190908,
title = {Apparatus for the compact cooling of modules},
author = {Iyengar, Madhusudan K. and Parida, Pritish R.},
abstractNote = {An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {7}
}

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Works referenced in this record:

Thermal Characteristics of Chip Stack and Package Stack Memory Devices in the Component and Module Level
conference, March 2007

  • Lee, Heejin; Lee, Haehyung; Byun, Jaebeom
  • Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium
  • DOI: 10.1109/STHERM.2007.352386