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Title: Maskless laser writing of microscopic metallic interconnects

A method of forming a metal pattern on a substrate is disclosed. The method includes depositing an insulative nitride film on a substrate and irradiating a laser beam onto the nitride film, thus decomposing the metal nitride into a metal constituent and a gaseous constituent, the metal constituent remaining in the nitride film as a conductive pattern. 4 figs.
Inventors:
Issue Date:
OSTI Identifier:
119056
Assignee:
Marietta Energy Systems, Inc., Oak Ridge, TN (United States) PTO; SCA: 426000; PA: EDB-95:150247; SN: 95001477077
Patent Number(s):
US 5,459,098/A/
Application Number:
PAN: 7-962,811
Contract Number:
AC05-84OR21400
Resource Relation:
Other Information: PBD: 17 Oct 1995
Research Org:
Lockheed Martin Energy Syst Inc
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; MICROELECTRONIC CIRCUITS; FABRICATION; MASKING; LASER RADIATION; ELECTRIC CONDUCTORS