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Title: Maskless laser writing of microscopic metallic interconnects

Abstract

A method of forming a metal pattern on a substrate is disclosed. The method includes depositing an insulative nitride film on a substrate and irradiating a laser beam onto the nitride film, thus decomposing the metal nitride into a metal constituent and a gaseous constituent, the metal constituent remaining in the nitride film as a conductive pattern. 4 figs.

Inventors:
Issue Date:
Research Org.:
Lockheed Martin Energy Syst Inc
OSTI Identifier:
119056
Patent Number(s):
5,459,098
Application Number:
PAN: 7-962,811
Assignee:
Marietta Energy Systems, Inc., Oak Ridge, TN (United States)
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 17 Oct 1995
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; MICROELECTRONIC CIRCUITS; FABRICATION; MASKING; LASER RADIATION; ELECTRIC CONDUCTORS

Citation Formats

Maya, L. Maskless laser writing of microscopic metallic interconnects. United States: N. p., 1995. Web.
Maya, L. Maskless laser writing of microscopic metallic interconnects. United States.
Maya, L. Tue . "Maskless laser writing of microscopic metallic interconnects". United States.
@article{osti_119056,
title = {Maskless laser writing of microscopic metallic interconnects},
author = {Maya, L},
abstractNote = {A method of forming a metal pattern on a substrate is disclosed. The method includes depositing an insulative nitride film on a substrate and irradiating a laser beam onto the nitride film, thus decomposing the metal nitride into a metal constituent and a gaseous constituent, the metal constituent remaining in the nitride film as a conductive pattern. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {10}
}