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Title: Diorganosilacetylene-alt-diorganosilvinylene polymers and a process of preparation

The present invention provides linear organosilicon polymers including acetylene and vinylene moieties, and a process for their preparation. These diorganosilacetylene-alt-diorganosilvinylene linear polymers can be represented by the formula: --[--(R{sup 1})(R{sup 2})Si--C{triple_bond}C--(R{sup 3})(R{sup 4})Si--CH{double_bond}CH--]{sub n}--, wherein n{>=}2; and each R{sup 1}, R{sup 2}, R{sup 3}, and R{sup 4} is independently selected from the group consisting of hydrogen, halogen, alkyl, alkenyl, aryl, and aralkyl radicals. The polymers are soluble in organic solvents, air stable, and can be pulled into fibers or cast into films. They can be thermally converted into silicon carbide ceramic materials.
Inventors:
; ;
Issue Date:
OSTI Identifier:
119045
Assignee:
Iowa State Univ. Research Foundation, Inc., Ames, IA (United States) PTO; SCA: 400201; 360201; PA: EDB-95:149773; SN: 95001477084
Patent Number(s):
US 5,457,074/A/
Application Number:
PAN: 8-202,936
Contract Number:
W-7405-ENG-82
Resource Relation:
Other Information: PBD: 10 Oct 1995
Research Org:
Iowa State University
Country of Publication:
United States
Language:
English
Subject:
40 CHEMISTRY; 36 MATERIALS SCIENCE; ORGANIC SILICON COMPOUNDS; CHEMICAL PREPARATION; ORGANIC POLYMERS; SILICON CARBIDES; PRECURSOR; MOLECULAR STRUCTURE; SOLUBILITY; HEAT TREATMENTS; THIN FILMS; FIBERS

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