skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Method of fabricating high-density hermetic electrical feedthroughs

Abstract

A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed.

Inventors:
; ;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1183342
Patent Number(s):
9,048,012
Application Number:
14/009,332
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
60 APPLIED LIFE SCIENCES; 36 MATERIALS SCIENCE; 59 BASIC BIOLOGICAL SCIENCES

Citation Formats

Shah, Kedar G., Pannu, Satinderpall S., and Delima, Terri L. Method of fabricating high-density hermetic electrical feedthroughs. United States: N. p., 2015. Web.
Shah, Kedar G., Pannu, Satinderpall S., & Delima, Terri L. Method of fabricating high-density hermetic electrical feedthroughs. United States.
Shah, Kedar G., Pannu, Satinderpall S., and Delima, Terri L. Tue . "Method of fabricating high-density hermetic electrical feedthroughs". United States. https://www.osti.gov/servlets/purl/1183342.
@article{osti_1183342,
title = {Method of fabricating high-density hermetic electrical feedthroughs},
author = {Shah, Kedar G. and Pannu, Satinderpall S. and Delima, Terri L.},
abstractNote = {A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {6}
}

Patent:

Save / Share: