Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
Abstract
Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1179238
- Patent Number(s):
- 9027360
- Application Number:
- 13/102,195
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F25 - REFRIGERATION OR COOLING F25B - REFRIGERATION MACHINES, PLANTS OR SYSTEMS
F - MECHANICAL ENGINEERING F25 - REFRIGERATION OR COOLING F25D - REFRIGERATORS
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2011 May 06
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 47 OTHER INSTRUMENTATION
Citation Formats
Chainer, Timothy J, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, and Steinke, Mark E. Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system. United States: N. p., 2015.
Web.
Chainer, Timothy J, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, & Steinke, Mark E. Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system. United States.
Chainer, Timothy J, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, and Steinke, Mark E. Tue .
"Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system". United States. https://www.osti.gov/servlets/purl/1179238.
@article{osti_1179238,
title = {Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system},
author = {Chainer, Timothy J and Graybill, David P and Iyengar, Madhusudan K and Kamath, Vinod and Kochuparambil, Bejoy J and Schmidt, Roger R and Steinke, Mark E},
abstractNote = {Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 12 00:00:00 EDT 2015},
month = {Tue May 12 00:00:00 EDT 2015}
}
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- Meijer, Ingmar G.; Schmidt, Derek L.; Steinke, Mark E.
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Thermoelectric-Enhanced Air and Liquid Cooling of an Electronic System
patent-application, March 2014
- Campbell, Levi A.; Chu, Richard C.; David, Milnes P.
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Sectioned Manifolds Facilitating Pumped Immersion-Cooling Of Electronic Components
patent-application, May 2014
- Campbell, Levi A.; Chu, Richard C.; David, Milnes P.
- US Patent Application 13/788919; 20140123493