Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules
Abstract
Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1178242
- Patent Number(s):
- 9013046
- Application Number:
- 13/945,074
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Jul 18
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Rodenbeck, Christopher T, and Girardi, Michael. Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules. United States: N. p., 2015.
Web.
Rodenbeck, Christopher T, & Girardi, Michael. Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules. United States.
Rodenbeck, Christopher T, and Girardi, Michael. Tue .
"Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules". United States. https://www.osti.gov/servlets/purl/1178242.
@article{osti_1178242,
title = {Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules},
author = {Rodenbeck, Christopher T and Girardi, Michael},
abstractNote = {Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {4}
}
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