Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules

Rodenbeck, Christopher T; Girardi, Michael

Title: Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules

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Abstract

Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

Inventors:: Rodenbeck, Christopher T; Girardi, Michael

Issue Date:: 2015-04-21

Research Org.:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1178242

Patent Number(s):: 9013046

Application Number:: 13/945,074

Assignee:: Sandia Corporation (Albuquerque, NM)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/207 - Diameter ranges
H01L2224/05599 - Material
H01L2224/48227 - connecting the wire to a bond pad of the item
H01L24/48 - {of an individual wire connector}
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2224/85013 - Plasma cleaning
H01L24/02 - {Bonding areas
H01L2924/14 - Integrated circuits
H01L24/85 - {using a wire connector
H01L2224/85986 - Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
H01L24/03 - {Manufacturing methods}
H01L2224/85399 - Material
H01L2224/92247 - the second connecting process involving a wire connector
H01L2224/45015 - being circular
H01L2224/45099 - Material
H01L2224/8511 - involving protection against electrical discharge, e.g. removing electrostatic charge

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Resource Relation:: Patent File Date: 2013 Jul 18

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Rodenbeck, Christopher T, and Girardi, Michael. Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules.  United States: N. p., 2015. 
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                    Rodenbeck, Christopher T, & Girardi, Michael. Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules.  United States.

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                    Rodenbeck, Christopher T, and Girardi, Michael. Tue .  
        "Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules".  United States.  https://www.osti.gov/servlets/purl/1178242.

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@article{osti_1178242,

  title        = {Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules},

  author       = {Rodenbeck, Christopher T and Girardi, Michael},

  abstractNote = {Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2015},

  month        = {4}

}

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