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Title: Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules

Abstract

Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

Inventors:
;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1178242
Patent Number(s):
9,013,046
Application Number:
13/945,074
Assignee:
Sandia Corporation (Albuquerque, NM)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Jul 18
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Rodenbeck, Christopher T, and Girardi, Michael. Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules. United States: N. p., 2015. Web.
Rodenbeck, Christopher T, & Girardi, Michael. Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules. United States.
Rodenbeck, Christopher T, and Girardi, Michael. Tue . "Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules". United States. https://www.osti.gov/servlets/purl/1178242.
@article{osti_1178242,
title = {Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules},
author = {Rodenbeck, Christopher T and Girardi, Michael},
abstractNote = {Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {4}
}

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