Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system
Abstract
A method for fabricating a thermophotovoltaic energy conversion cell including a thin semiconductor wafer substrate (10) having a thickness (.beta.) calculated to decrease the free carrier absorption on a heavily doped substrate; wherein the top surface of the semiconductor wafer substrate is provided with a thermophotovoltaic device (11), a metallized grid (12) and optionally an antireflective (AR) overcoating; and, the bottom surface (10') of the semiconductor wafer substrate (10) is provided with a highly reflecting coating which may comprise a metal coating (14) or a combined dielectric/metal coating (17).
- Inventors:
- Issue Date:
- Research Org.:
- KAPL Inc., Schenectady, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1176672
- Patent Number(s):
- H001856
- Application Number:
- 08/740517
- Assignee:
- The United States of America as represented by the United States Department of Energy (Washington, DC)
- DOE Contract Number:
- AC12-76SN00052
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 1996 Oct 30
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 30 DIRECT ENERGY CONVERSION; 36 MATERIALS SCIENCE; statutory invention registration
Citation Formats
Baldasaro, Paul F., Brown, Edward J., Charache, Greg W., and DePoy, David M. Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system. United States: N. p., 2000.
Web.
Baldasaro, Paul F., Brown, Edward J., Charache, Greg W., & DePoy, David M. Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system. United States.
Baldasaro, Paul F., Brown, Edward J., Charache, Greg W., and DePoy, David M. Tue .
"Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system". United States. https://www.osti.gov/servlets/purl/1176672.
@article{osti_1176672,
title = {Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system},
author = {Baldasaro, Paul F. and Brown, Edward J. and Charache, Greg W. and DePoy, David M.},
abstractNote = {A method for fabricating a thermophotovoltaic energy conversion cell including a thin semiconductor wafer substrate (10) having a thickness (.beta.) calculated to decrease the free carrier absorption on a heavily doped substrate; wherein the top surface of the semiconductor wafer substrate is provided with a thermophotovoltaic device (11), a metallized grid (12) and optionally an antireflective (AR) overcoating; and, the bottom surface (10') of the semiconductor wafer substrate (10) is provided with a highly reflecting coating which may comprise a metal coating (14) or a combined dielectric/metal coating (17).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {9}
}
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Works referenced in this record: