Apparatus and process for deposition of hard carbon films
Abstract
A process and an apparatus for depositing thin, amorphous carbon films having extreme hardness on a substrate is described. An enclosed chamber maintained at less than atmospheric pressure houses the substrate and plasma producing elements. A first electrode is comprised of a cavity enclosed within an RF coil which excites the plasma. A substrate located on a second electrode is excited by radio frequency power applied to the substrate. A magnetic field confines the plasma produced by the first electrode to the area away from the walls of the chamber and focuses the plasma onto the substrate thereby yielding film deposits having higher purity and having more rapid buildup than other methods of the prior art.
- Inventors:
- Issue Date:
- Research Org.:
- US Department of Energy (USDOE), Washington DC (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1176591
- Patent Number(s):
- H000566
- Assignee:
- United States Of America, Department Of Energy
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 70 PLASMA PHYSICS AND FUSION TECHNOLOGY
Citation Formats
Nyaiesh, Ali R., and Garwin, Edward L. Apparatus and process for deposition of hard carbon films. United States: N. p., 1989.
Web.
Nyaiesh, Ali R., & Garwin, Edward L. Apparatus and process for deposition of hard carbon films. United States.
Nyaiesh, Ali R., and Garwin, Edward L. Tue .
"Apparatus and process for deposition of hard carbon films". United States. https://www.osti.gov/servlets/purl/1176591.
@article{osti_1176591,
title = {Apparatus and process for deposition of hard carbon films},
author = {Nyaiesh, Ali R. and Garwin, Edward L.},
abstractNote = {A process and an apparatus for depositing thin, amorphous carbon films having extreme hardness on a substrate is described. An enclosed chamber maintained at less than atmospheric pressure houses the substrate and plasma producing elements. A first electrode is comprised of a cavity enclosed within an RF coil which excites the plasma. A substrate located on a second electrode is excited by radio frequency power applied to the substrate. A magnetic field confines the plasma produced by the first electrode to the area away from the walls of the chamber and focuses the plasma onto the substrate thereby yielding film deposits having higher purity and having more rapid buildup than other methods of the prior art.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {1}
}
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