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Title: Light emitting diode package element with internal meniscus for bubble free lens placement

Abstract

A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature. An inner encapsulant is provided over the LED chip with the inner encapsulant having a contacting surface on the substrate, with the meniscus holding feature which defines the edge of the contacting surface. An optical element is included having a bottom surface with at least a portion that is concave. The optical element is arranged on the substrate with the concave portionmore » over the LED chip. A contacting encapsulant is included between the inner encapsulant and optical element.

Inventors:
; ; ;
Issue Date:
Research Org.:
Cree, Inc., Goleta, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1176415
Patent Number(s):
7804147
Application Number:
11/496,918
Assignee:
Cree, Inc. (Goleta, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
FC26-05NT42340
Resource Type:
Patent
Resource Relation:
Patent File Date: 2006 Jul 31
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS

Citation Formats

Tarsa, Eric, Yuan, Thomas C., Becerra, Maryanne, and Yadev, Praveen. Light emitting diode package element with internal meniscus for bubble free lens placement. United States: N. p., 2010. Web.
Tarsa, Eric, Yuan, Thomas C., Becerra, Maryanne, & Yadev, Praveen. Light emitting diode package element with internal meniscus for bubble free lens placement. United States.
Tarsa, Eric, Yuan, Thomas C., Becerra, Maryanne, and Yadev, Praveen. Tue . "Light emitting diode package element with internal meniscus for bubble free lens placement". United States. https://www.osti.gov/servlets/purl/1176415.
@article{osti_1176415,
title = {Light emitting diode package element with internal meniscus for bubble free lens placement},
author = {Tarsa, Eric and Yuan, Thomas C. and Becerra, Maryanne and Yadev, Praveen},
abstractNote = {A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature. An inner encapsulant is provided over the LED chip with the inner encapsulant having a contacting surface on the substrate, with the meniscus holding feature which defines the edge of the contacting surface. An optical element is included having a bottom surface with at least a portion that is concave. The optical element is arranged on the substrate with the concave portion over the LED chip. A contacting encapsulant is included between the inner encapsulant and optical element.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2010},
month = {9}
}

Works referenced in this record:

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  • https://doi.org/10.1109/ISPSD.1998.702691

Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup
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New UV Light Emitter Based on AlGaN Heterostructures with Graded Electron and Hole Injectors
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Enhancement of base conductivity via the piezoelectric effect in AlGaN/GaN HBTs
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Polarization-Induced 3-Dimensional Electron Slabs in Graded AlGaN Layers
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