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Title: Composite patterning devices for soft lithography

The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.
Inventors:
;
Issue Date:
OSTI Identifier:
1176164
Assignee:
The Board of Trustees of the University of Illinois (Urbana, IL) OSTI
Patent Number(s):
7,195,733
Application Number:
11/115,954
Contract Number:
FG02-91ER45439
Research Org:
The Board of Trustees of the University of Illinois, Urbana, IL (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE