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Title: Composite patterning devices for soft lithography


The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.

Issue Date:
Research Org.:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Org.:
OSTI Identifier:
Patent Number(s):
Application Number:
The Board of Trustees of the University of Illinois (Urbana, IL)
Patent Classifications (CPCs):
DOE Contract Number:  
Resource Type:
Resource Relation:
Patent File Date: 2005 Apr 27
Country of Publication:
United States

Citation Formats

Rogers, John A., and Menard, Etienne. Composite patterning devices for soft lithography. United States: N. p., 2007. Web.
Rogers, John A., & Menard, Etienne. Composite patterning devices for soft lithography. United States.
Rogers, John A., and Menard, Etienne. Tue . "Composite patterning devices for soft lithography". United States.
title = {Composite patterning devices for soft lithography},
author = {Rogers, John A. and Menard, Etienne},
abstractNote = {The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {3}

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