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Title: Composite patterning devices for soft lithography

Abstract

The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.

Inventors:
;
Issue Date:
Research Org.:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1176164
Patent Number(s):
7195733
Application Number:
11/115,954
Assignee:
The Board of Trustees of the University of Illinois (Urbana, IL)
Patent Classifications (CPCs):
C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
DOE Contract Number:  
FG02-91ER45439
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Rogers, John A., and Menard, Etienne. Composite patterning devices for soft lithography. United States: N. p., 2007. Web.
Rogers, John A., & Menard, Etienne. Composite patterning devices for soft lithography. United States.
Rogers, John A., and Menard, Etienne. Tue . "Composite patterning devices for soft lithography". United States. https://www.osti.gov/servlets/purl/1176164.
@article{osti_1176164,
title = {Composite patterning devices for soft lithography},
author = {Rogers, John A. and Menard, Etienne},
abstractNote = {The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {3}
}

Patent:

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