Fluid cooled electrical assembly
Abstract
A heat producing, fluid cooled assembly that includes a housing made of liquid-impermeable material, which defines a fluid inlet and a fluid outlet and an opening. Also included is an electrical package having a set of semiconductor electrical devices supported on a substrate and the second major surface is a heat sink adapted to express heat generated from the electrical apparatus and wherein the second major surface defines a rim that is fit to the opening. Further, the housing is constructed so that as fluid travels from the fluid inlet to the fluid outlet it is constrained to flow past the opening thereby placing the fluid in contact with the heat sink.
- Inventors:
- Issue Date:
- Research Org.:
- Rinehart Motion Systems, LLC, Wilsonville, OR (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1176099
- Patent Number(s):
- 7173823
- Application Number:
- 11/016,603
- Assignee:
- Rinehart Motion Systems, LLC (Wilsonville, OR)
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- DOE Contract Number:
- FG02-03ER83768
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Rinehart, Lawrence E., and Romero, Guillermo L. Fluid cooled electrical assembly. United States: N. p., 2007.
Web.
Rinehart, Lawrence E., & Romero, Guillermo L. Fluid cooled electrical assembly. United States.
Rinehart, Lawrence E., and Romero, Guillermo L. Tue .
"Fluid cooled electrical assembly". United States. https://www.osti.gov/servlets/purl/1176099.
@article{osti_1176099,
title = {Fluid cooled electrical assembly},
author = {Rinehart, Lawrence E. and Romero, Guillermo L.},
abstractNote = {A heat producing, fluid cooled assembly that includes a housing made of liquid-impermeable material, which defines a fluid inlet and a fluid outlet and an opening. Also included is an electrical package having a set of semiconductor electrical devices supported on a substrate and the second major surface is a heat sink adapted to express heat generated from the electrical apparatus and wherein the second major surface defines a rim that is fit to the opening. Further, the housing is constructed so that as fluid travels from the fluid inlet to the fluid outlet it is constrained to flow past the opening thereby placing the fluid in contact with the heat sink.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {2}
}
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