Narrow energy band gap gallium arsenide nitride semi-conductors and an ion-cut-synthesis method for producing the same
Abstract
A method for forming a semi-conductor material is provided that comprises forming a donor substrate constructed of GaAs, providing a receiver substrate, implanting nitrogen into the donor substrate to form an implanted layer comprising GaAs and nitrogen. The implanted layer is bonded to the receiver substrate and annealed to form GaAsN and nitrogen micro-blisters in the implanted layer. The micro-blisters allow the implanted layer to be cleaved from the donor substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of Michigan, Ann Arbor, MI (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175777
- Patent Number(s):
- 7056815
- Application Number:
- 10/706,737
- Assignee:
- The Regents of the University of Michigan (Ann Arbor, MI)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Weng, Xiaojun, and Goldman, Rachel S. Narrow energy band gap gallium arsenide nitride semi-conductors and an ion-cut-synthesis method for producing the same. United States: N. p., 2006.
Web.
Weng, Xiaojun, & Goldman, Rachel S. Narrow energy band gap gallium arsenide nitride semi-conductors and an ion-cut-synthesis method for producing the same. United States.
Weng, Xiaojun, and Goldman, Rachel S. Tue .
"Narrow energy band gap gallium arsenide nitride semi-conductors and an ion-cut-synthesis method for producing the same". United States. https://www.osti.gov/servlets/purl/1175777.
@article{osti_1175777,
title = {Narrow energy band gap gallium arsenide nitride semi-conductors and an ion-cut-synthesis method for producing the same},
author = {Weng, Xiaojun and Goldman, Rachel S.},
abstractNote = {A method for forming a semi-conductor material is provided that comprises forming a donor substrate constructed of GaAs, providing a receiver substrate, implanting nitrogen into the donor substrate to form an implanted layer comprising GaAs and nitrogen. The implanted layer is bonded to the receiver substrate and annealed to form GaAsN and nitrogen micro-blisters in the implanted layer. The micro-blisters allow the implanted layer to be cleaved from the donor substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {6}
}