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Title: Pin-deposition of conductive inks for microelectrodes and contact via filling

Abstract

A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.

Inventors:
; ; ; ; ;
Issue Date:
Research Org.:
The Regents of the University of California, Oakland, CA (United States); Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175725
Patent Number(s):
7,036,220
Application Number:
10/742,112
Assignee:
The Regents of the University of California (Oakland, CA)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Davidson, J. Courtney, Krulevitch, Peter A., Maghribi, Mariam N., Hamilton, Julie K., Benett, William J., and Tovar, Armando R. Pin-deposition of conductive inks for microelectrodes and contact via filling. United States: N. p., 2006. Web.
Davidson, J. Courtney, Krulevitch, Peter A., Maghribi, Mariam N., Hamilton, Julie K., Benett, William J., & Tovar, Armando R. Pin-deposition of conductive inks for microelectrodes and contact via filling. United States.
Davidson, J. Courtney, Krulevitch, Peter A., Maghribi, Mariam N., Hamilton, Julie K., Benett, William J., and Tovar, Armando R. Tue . "Pin-deposition of conductive inks for microelectrodes and contact via filling". United States. https://www.osti.gov/servlets/purl/1175725.
@article{osti_1175725,
title = {Pin-deposition of conductive inks for microelectrodes and contact via filling},
author = {Davidson, J. Courtney and Krulevitch, Peter A. and Maghribi, Mariam N. and Hamilton, Julie K. and Benett, William J. and Tovar, Armando R.},
abstractNote = {A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {5}
}

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