Pin-deposition of conductive inks for microelectrodes and contact via filling
Abstract
A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of California, Oakland, CA (United States); Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175725
- Patent Number(s):
- 7036220
- Application Number:
- 10/742,112
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Davidson, J. Courtney, Krulevitch, Peter A., Maghribi, Mariam N., Hamilton, Julie K., Benett, William J., and Tovar, Armando R.. Pin-deposition of conductive inks for microelectrodes and contact via filling. United States: N. p., 2006.
Web.
Davidson, J. Courtney, Krulevitch, Peter A., Maghribi, Mariam N., Hamilton, Julie K., Benett, William J., & Tovar, Armando R.. Pin-deposition of conductive inks for microelectrodes and contact via filling. United States.
Davidson, J. Courtney, Krulevitch, Peter A., Maghribi, Mariam N., Hamilton, Julie K., Benett, William J., and Tovar, Armando R.. Tue .
"Pin-deposition of conductive inks for microelectrodes and contact via filling". United States. https://www.osti.gov/servlets/purl/1175725.
@article{osti_1175725,
title = {Pin-deposition of conductive inks for microelectrodes and contact via filling},
author = {Davidson, J. Courtney and Krulevitch, Peter A. and Maghribi, Mariam N. and Hamilton, Julie K. and Benett, William J. and Tovar, Armando R.},
abstractNote = {A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {5}
}
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