Encapsulants for protecting MEMS devices during post-packaging release etch
Abstract
The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a "package first, release later" manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.
- Inventors:
- Issue Date:
- Research Org.:
- ~Individually Owned Patent
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175530
- Patent Number(s):
- 6956283
- Application Number:
- 10/606,525
- Assignee:
- Peterson, Kenneth A.
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Peterson, Kenneth A. Encapsulants for protecting MEMS devices during post-packaging release etch. United States: N. p., 2005.
Web.
Peterson, Kenneth A. Encapsulants for protecting MEMS devices during post-packaging release etch. United States.
Peterson, Kenneth A. Tue .
"Encapsulants for protecting MEMS devices during post-packaging release etch". United States. https://www.osti.gov/servlets/purl/1175530.
@article{osti_1175530,
title = {Encapsulants for protecting MEMS devices during post-packaging release etch},
author = {Peterson, Kenneth A.},
abstractNote = {The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a "package first, release later" manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 18 00:00:00 EDT 2005},
month = {Tue Oct 18 00:00:00 EDT 2005}
}
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