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Title: Cascaded die mountings with spring-loaded contact-bond options

Abstract

A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.

Inventors:
; ; ; ; ;
Issue Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175468
Patent Number(s):
6930385
Application Number:
10/738,746
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Hsu, John S., Adams, Donald J., Su, Gui-Jia, Marlino, Laura D., Ayers, Curtis W., and Coomer, Chester. Cascaded die mountings with spring-loaded contact-bond options. United States: N. p., 2005. Web.
Hsu, John S., Adams, Donald J., Su, Gui-Jia, Marlino, Laura D., Ayers, Curtis W., & Coomer, Chester. Cascaded die mountings with spring-loaded contact-bond options. United States.
Hsu, John S., Adams, Donald J., Su, Gui-Jia, Marlino, Laura D., Ayers, Curtis W., and Coomer, Chester. Tue . "Cascaded die mountings with spring-loaded contact-bond options". United States. https://www.osti.gov/servlets/purl/1175468.
@article{osti_1175468,
title = {Cascaded die mountings with spring-loaded contact-bond options},
author = {Hsu, John S. and Adams, Donald J. and Su, Gui-Jia and Marlino, Laura D. and Ayers, Curtis W. and Coomer, Chester},
abstractNote = {A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {8}
}

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Works referenced in this record:

Flip-chip flex-circuit packaging for 42 V/16 A integrated power electronics module applications
conference, January 2002

  • Xiao, Y.; Natarajan, R.; Chow, T. P.
  • APEC 2002 - Applied Power Electronics Conference and Exposition, APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335)
  • https://doi.org/10.1109/APEC.2002.989222