Cascaded die mountings with spring-loaded contact-bond options
Abstract
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
- Inventors:
- Issue Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175468
- Patent Number(s):
- 6930385
- Application Number:
- 10/738,746
- Assignee:
- UT-Battelle, LLC (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC05-00OR22725
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Hsu, John S., Adams, Donald J., Su, Gui-Jia, Marlino, Laura D., Ayers, Curtis W., and Coomer, Chester. Cascaded die mountings with spring-loaded contact-bond options. United States: N. p., 2005.
Web.
Hsu, John S., Adams, Donald J., Su, Gui-Jia, Marlino, Laura D., Ayers, Curtis W., & Coomer, Chester. Cascaded die mountings with spring-loaded contact-bond options. United States.
Hsu, John S., Adams, Donald J., Su, Gui-Jia, Marlino, Laura D., Ayers, Curtis W., and Coomer, Chester. Tue .
"Cascaded die mountings with spring-loaded contact-bond options". United States. https://www.osti.gov/servlets/purl/1175468.
@article{osti_1175468,
title = {Cascaded die mountings with spring-loaded contact-bond options},
author = {Hsu, John S. and Adams, Donald J. and Su, Gui-Jia and Marlino, Laura D. and Ayers, Curtis W. and Coomer, Chester},
abstractNote = {A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {8}
}
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