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Title: Composition and method for removing photoresist materials from electronic components

Abstract

Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.

Inventors:
; ;
Issue Date:
Research Org.:
Univ. of California, Oakland, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175216
Patent Number(s):
6846789
Application Number:
10/133,709
Assignee:
The Regents of the University of California (Los Alamos, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B08 - CLEANING B08B - CLEANING IN GENERAL
C - CHEMISTRY C11 - ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES C11D - DETERGENT COMPOSITIONS
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Davenhall, Leisa B., Rubin, James B., and Taylor, Craig M. Composition and method for removing photoresist materials from electronic components. United States: N. p., 2005. Web.
Davenhall, Leisa B., Rubin, James B., & Taylor, Craig M. Composition and method for removing photoresist materials from electronic components. United States.
Davenhall, Leisa B., Rubin, James B., and Taylor, Craig M. Tue . "Composition and method for removing photoresist materials from electronic components". United States. https://www.osti.gov/servlets/purl/1175216.
@article{osti_1175216,
title = {Composition and method for removing photoresist materials from electronic components},
author = {Davenhall, Leisa B. and Rubin, James B. and Taylor, Craig M.},
abstractNote = {Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 25 00:00:00 EST 2005},
month = {Tue Jan 25 00:00:00 EST 2005}
}