Electrical latching of microelectromechanical devices

Title: Electrical latching of microelectromechanical devices

Abstract

Methods are disclosed for row and column addressing of an array of microelectromechanical (MEM) devices. The methods of the present invention are applicable to MEM micromirrors or memory elements and allow the MEM array to be programmed and maintained latched in a programmed state with a voltage that is generally lower than the voltage required for electrostatically switching the MEM devices.

Inventors:: Garcia, Ernest J.; Sleefe, Gerard E.

Issue Date:: 2004-11-02

Research Org.:: Sandia National Lab. (SNL-CA), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1175117

Patent Number(s):: 6813060

Application Number:: 10/316,172

Assignee:: Sandia Corporation

Patent Classifications (CPCs):: G - PHYSICS G09 - EDUCATION G09G - ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION

Show more

G - PHYSICS G09 - EDUCATION G09G - ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
G09G3/346 - {based on modulation of the reflection angle, e.g. micromirrors

Show less

DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Garcia, Ernest J., and Sleefe, Gerard E. Electrical latching of microelectromechanical devices.  United States: N. p., 2004. 
        Web.

Copy to clipboard


                    Garcia, Ernest J., & Sleefe, Gerard E. Electrical latching of microelectromechanical devices.  United States.

Copy to clipboard


                    Garcia, Ernest J., and Sleefe, Gerard E. Tue .  
        "Electrical latching of microelectromechanical devices".  United States.  https://www.osti.gov/servlets/purl/1175117.

Copy to clipboard


                    
@article{osti_1175117,

  title        = {Electrical latching of microelectromechanical devices},

  author       = {Garcia, Ernest J. and Sleefe, Gerard E.},

  abstractNote = {Methods are disclosed for row and column addressing of an array of microelectromechanical (MEM) devices. The methods of the present invention are applicable to MEM micromirrors or memory elements and allow the MEM array to be programmed and maintained latched in a programmed state with a voltage that is generally lower than the voltage required for electrostatically switching the MEM devices.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2004},

  month        = {11}

}

Copy to clipboard

Patent:

View Patent

Save / Share:

Export Metadata

Save to My Library

Works referenced in this record:

Silicon micromirrors and their prospective application in the Next-Generation Space Telescope
conference, November 2002

Garcia, Ernest J.; Polosky, Marc A.; Sleefe, Gerard E.
International Symposium on Optical Science and Technology, SPIE Proceedings
https://doi.org/10.1117/12.453829

Similar Records in DOE Patents and OSTI.GOV collections:

Microelectromechanical safe arm device

Patent Roesler, Alexander W [Tijeras, NM]

Microelectromechanical (MEM) apparatus and methods for operating, for preventing unintentional detonation of energetic components comprising pyrotechnic and explosive materials, such as air bag deployment systems, munitions and pyrotechnics. The MEM apparatus comprises an interrupting member that can be moved to block (interrupt) or complete (uninterrupt) an explosive train that is part of an energetic component. One or more latching members are provided that engage and prevent the movement of the interrupting member, until the one or more latching members are disengaged from the interrupting member. The MEM apparatus can be utilized as a safe and arm device (SAD) and electronicmore »« less
Full Text Available
Method for integrating microelectromechanical devices with electronic circuitry

Patent Montague, Stephen [Albuquerque, NM]; Smith, James H [Albuquerque, NM]; Sniegowski, Jeffry J [Albuquerque, NM]; ...

A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.
Full Text Available
Use of silicon oxynitride as a sacrificial material for microelectromechanical devices

Patent Habermehl, Scott D [Corrales, NM]; Sniegowski, Jeffry J [Edgewood, NM]

The use of silicon oxynitride (SiO.sub.x N.sub.y) as a sacrificial material for forming a microelectromechanical (MEM) device is disclosed. Whereas conventional sacrificial materials such as silicon dioxide and silicate glasses are compressively strained, the composition of silicon oxynitride can be selected to be either tensile-strained or substantially-stress-free. Thus, silicon oxynitride can be used in combination with conventional sacrificial materials to limit an accumulation of compressive stress in a MEM device; or alternately the MEM device can be formed entirely with silicon oxynitride. Advantages to be gained from the use of silicon oxynitride as a sacrificial material for a MEM devicemore »« less
Full Text Available
Chemical-mechanical polishing of recessed microelectromechanical devices

Patent Barron, Carole C [Albuquerque, NM]; Hetherington, Dale L [Albuquerque, NM]; Montague, Stephen [Albuquerque, NM]

A method is disclosed for micromachining recessed layers (e.g. sacrificial layers) of a microelectromechanical system (MEMS) device formed in a cavity etched into a semiconductor substrate. The method uses chemical-mechanical polishing (CMP) with a resilient polishing pad to locally planarize one or more of the recessed layers within the substrate cavity. Such local planarization using the method of the present invention is advantageous for improving the patterning of subsequently deposited layers, for eliminating mechanical interferences between functional elements (e.g. linkages) of the MEMS device, and for eliminating the formation of stringers. After the local planarization of one or more ofmore »« less
Full Text Available
Thermally-induced voltage alteration for analysis of microelectromechanical devices

Patent Walraven, Jeremy A [Albuquerque, NM]; Cole, Jr., Edward I. (Albuquerque, NM)

A thermally-induced voltage alteration (TIVA) apparatus and method are disclosed for analyzing a microelectromechanical (MEM) device with or without on-board integrated circuitry. One embodiment of the TIVA apparatus uses constant-current biasing of the MEM device while scanning a focused laser beam over electrically-active members therein to produce localized heating which alters the power demand of the MEM device and thereby changes the voltage of the constant-current source. This changing voltage of the constant-current source can be measured and used in combination with the position of the focused and scanned laser beam to generate an image of any short-circuit defects inmore »« less
Full Text Available

Similar Records

Title: Electrical latching of microelectromechanical devices

Abstract

Citation Formats

Silicon micromirrors and their prospective application in the Next-Generation Space Telescope conference, November 2002

Silicon micromirrors and their prospective application in the Next-Generation Space Telescope
conference, November 2002