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Title: Process for fabricating a microelectromechanical structure

Abstract

A process is disclosed for forming a microelectromechanical (MEM) structure on a substrate having from 5 to 6 or more layers of deposited and patterned polysilicon. The process is based on determining a radius of curvature of the substrate which is bowed due to accumulated stress in the layers of polysilicon and a sacrificial material used to buildup the MEM structure, and then providing one or more stress-compensation layers on a backside of the substrate to flatten the substrate and allow further processing.

Inventors:
; ; ; ; ; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175096
Patent Number(s):
6808952
Application Number:
10/236,631
Assignee:
Sandia Corporation
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Sniegowski, Jeffry J., Krygowski, Thomas W., Mani, Seethambal S., Habermehl, Scott D., Hetherington, Dale L., Stevens, James E., Resnick, Paul J., and Volk, Steven R. Process for fabricating a microelectromechanical structure. United States: N. p., 2004. Web.
Sniegowski, Jeffry J., Krygowski, Thomas W., Mani, Seethambal S., Habermehl, Scott D., Hetherington, Dale L., Stevens, James E., Resnick, Paul J., & Volk, Steven R. Process for fabricating a microelectromechanical structure. United States.
Sniegowski, Jeffry J., Krygowski, Thomas W., Mani, Seethambal S., Habermehl, Scott D., Hetherington, Dale L., Stevens, James E., Resnick, Paul J., and Volk, Steven R. Tue . "Process for fabricating a microelectromechanical structure". United States. https://www.osti.gov/servlets/purl/1175096.
@article{osti_1175096,
title = {Process for fabricating a microelectromechanical structure},
author = {Sniegowski, Jeffry J. and Krygowski, Thomas W. and Mani, Seethambal S. and Habermehl, Scott D. and Hetherington, Dale L. and Stevens, James E. and Resnick, Paul J. and Volk, Steven R.},
abstractNote = {A process is disclosed for forming a microelectromechanical (MEM) structure on a substrate having from 5 to 6 or more layers of deposited and patterned polysilicon. The process is based on determining a radius of curvature of the substrate which is bowed due to accumulated stress in the layers of polysilicon and a sacrificial material used to buildup the MEM structure, and then providing one or more stress-compensation layers on a backside of the substrate to flatten the substrate and allow further processing.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {10}
}

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Works referenced in this record:

Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing
conference, October 1998

  • Hetherington, Dale L.; Sniegowski, Jeffry J.
  • SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, SPIE Proceedings
  • https://doi.org/10.1117/12.326692