Apparatus and method for controlling plating uniformity
Abstract
The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel--sulfamate bath. The shield is shown to improve the average current density at a plating surface.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175066
- Patent Number(s):
- 6802950
- Application Number:
- 10/304,175
- Assignee:
- Sandia National Laboratories
- Patent Classifications (CPCs):
-
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Hachman Jr., John T., Kelly, James J., and West, Alan C. Apparatus and method for controlling plating uniformity. United States: N. p., 2004.
Web.
Hachman Jr., John T., Kelly, James J., & West, Alan C. Apparatus and method for controlling plating uniformity. United States.
Hachman Jr., John T., Kelly, James J., and West, Alan C. Tue .
"Apparatus and method for controlling plating uniformity". United States. https://www.osti.gov/servlets/purl/1175066.
@article{osti_1175066,
title = {Apparatus and method for controlling plating uniformity},
author = {Hachman Jr., John T. and Kelly, James J. and West, Alan C.},
abstractNote = {The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel--sulfamate bath. The shield is shown to improve the average current density at a plating surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {10}
}
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- Cao, Yang; Taephaisitphongse, Premratn; Chalupa, Radek
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