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Title: Apparatus and method for controlling plating uniformity

Abstract

The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel--sulfamate bath. The shield is shown to improve the average current density at a plating surface.

Inventors:
; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175066
Patent Number(s):
6802950
Application Number:
10/304,175
Assignee:
Sandia National Laboratories
Patent Classifications (CPCs):
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Hachman Jr., John T., Kelly, James J., and West, Alan C. Apparatus and method for controlling plating uniformity. United States: N. p., 2004. Web.
Hachman Jr., John T., Kelly, James J., & West, Alan C. Apparatus and method for controlling plating uniformity. United States.
Hachman Jr., John T., Kelly, James J., and West, Alan C. Tue . "Apparatus and method for controlling plating uniformity". United States. https://www.osti.gov/servlets/purl/1175066.
@article{osti_1175066,
title = {Apparatus and method for controlling plating uniformity},
author = {Hachman Jr., John T. and Kelly, James J. and West, Alan C.},
abstractNote = {The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel--sulfamate bath. The shield is shown to improve the average current density at a plating surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {10}
}

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Works referenced in this record:

Three-Additive Model of Superfilling of Copper
journal, January 2001