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Title: Programmable multi-chip module

Abstract

A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

Inventors:
; ;
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174748
Patent Number(s):
6,700,196
Application Number:
10/253,851
Assignee:
Honeywell Federal Manufacturing & Technologies (Kansas City, MO) OSTI
DOE Contract Number:  
AC04-01AL66850
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING

Citation Formats

Kautz, David, Morgenstern, Howard, and Blazek, Roy J. Programmable multi-chip module. United States: N. p., 2004. Web.
Kautz, David, Morgenstern, Howard, & Blazek, Roy J. Programmable multi-chip module. United States.
Kautz, David, Morgenstern, Howard, and Blazek, Roy J. Tue . "Programmable multi-chip module". United States. https://www.osti.gov/servlets/purl/1174748.
@article{osti_1174748,
title = {Programmable multi-chip module},
author = {Kautz, David and Morgenstern, Howard and Blazek, Roy J.},
abstractNote = {A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {3}
}

Patent:

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