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Title: Enhanced adhesion for LIGA microfabrication by using a buffer layer

Abstract

The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized form pyromellitic anhydride and oxydianiline (PMDA-ODA).

Inventors:
; ;
Issue Date:
Research Org.:
United States Of America, Department Of Energy
Sponsoring Org.:
USDOE
OSTI Identifier:
1174702
Patent Number(s):
6,682,870
Assignee:
United States Of America, Department Of Energy OSTI
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Bajikar, Sateesh S., De Carlo, Francesco, and Song, Joshua J. Enhanced adhesion for LIGA microfabrication by using a buffer layer. United States: N. p., 2004. Web.
Bajikar, Sateesh S., De Carlo, Francesco, & Song, Joshua J. Enhanced adhesion for LIGA microfabrication by using a buffer layer. United States.
Bajikar, Sateesh S., De Carlo, Francesco, and Song, Joshua J. Tue . "Enhanced adhesion for LIGA microfabrication by using a buffer layer". United States. https://www.osti.gov/servlets/purl/1174702.
@article{osti_1174702,
title = {Enhanced adhesion for LIGA microfabrication by using a buffer layer},
author = {Bajikar, Sateesh S. and De Carlo, Francesco and Song, Joshua J.},
abstractNote = {The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized form pyromellitic anhydride and oxydianiline (PMDA-ODA).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {1}
}

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