Enhanced adhesion for LIGA microfabrication by using a buffer layer
Abstract
The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized form pyromellitic anhydride and oxydianiline (PMDA-ODA).
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1174702
- Patent Number(s):
- 6682870
- Application Number:
- 09/925,369
- Assignee:
- The United States of America as represented by the United States Department of Energy (Washington, DC)
- Patent Classifications (CPCs):
-
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- DOE Contract Number:
- W-31-109-ENG-38
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2001 Aug 10
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Bajikar, Sateesh S., De Carlo, Francesco, and Song, Joshua J. Enhanced adhesion for LIGA microfabrication by using a buffer layer. United States: N. p., 2004.
Web.
Bajikar, Sateesh S., De Carlo, Francesco, & Song, Joshua J. Enhanced adhesion for LIGA microfabrication by using a buffer layer. United States.
Bajikar, Sateesh S., De Carlo, Francesco, and Song, Joshua J. Tue .
"Enhanced adhesion for LIGA microfabrication by using a buffer layer". United States. https://www.osti.gov/servlets/purl/1174702.
@article{osti_1174702,
title = {Enhanced adhesion for LIGA microfabrication by using a buffer layer},
author = {Bajikar, Sateesh S. and De Carlo, Francesco and Song, Joshua J.},
abstractNote = {The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized form pyromellitic anhydride and oxydianiline (PMDA-ODA).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 27 00:00:00 EST 2004},
month = {Tue Jan 27 00:00:00 EST 2004}
}
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