Method for applying a photoresist layer to a substrate having a preexisting topology
Abstract
The present invention describes a method for preventing a photoresist layer from delaminating, peeling, away from the surface of a substrate that already contains an etched three dimensional structure such as a hole or a trench. The process comprises establishing a saturated vapor phase of the solvent media used to formulate the photoresist layer, above the surface of the coated substrate as the applied photoresist is heated in order to "cure" or drive off the retained solvent constituent within the layer. By controlling the rate and manner in which solvent is removed from the photoresist layer the layer is stabilized and kept from differentially shrinking and peeling away from the substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1174694
- Patent Number(s):
- 6680263
- Application Number:
- 10/074,195
- Assignee:
- Sandia National Laboratories (Livermore, CA)
- Patent Classifications (CPCs):
-
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Morales, Alfredo M., and Gonzales, Marcela. Method for applying a photoresist layer to a substrate having a preexisting topology. United States: N. p., 2004.
Web.
Morales, Alfredo M., & Gonzales, Marcela. Method for applying a photoresist layer to a substrate having a preexisting topology. United States.
Morales, Alfredo M., and Gonzales, Marcela. Tue .
"Method for applying a photoresist layer to a substrate having a preexisting topology". United States. https://www.osti.gov/servlets/purl/1174694.
@article{osti_1174694,
title = {Method for applying a photoresist layer to a substrate having a preexisting topology},
author = {Morales, Alfredo M. and Gonzales, Marcela},
abstractNote = {The present invention describes a method for preventing a photoresist layer from delaminating, peeling, away from the surface of a substrate that already contains an etched three dimensional structure such as a hole or a trench. The process comprises establishing a saturated vapor phase of the solvent media used to formulate the photoresist layer, above the surface of the coated substrate as the applied photoresist is heated in order to "cure" or drive off the retained solvent constituent within the layer. By controlling the rate and manner in which solvent is removed from the photoresist layer the layer is stabilized and kept from differentially shrinking and peeling away from the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {1}
}
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