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Title: Planar-constructed spatial micro-stage

Abstract

A multiple degree of freedom platform assembly formed from a plurality of thin films on a substrate can, when activated, move out of the plane of the substrate without additional manufacturing steps. The platform is connected to the substrate by at least three linkages, each linkage being pivotally connected to the platform and the base. At least two of the base connections are to powered traveling devices that are manufactured at one end of a path and which may be moved to locations along the path to cause the platform to move to predetermined positions. The entire assembly, including hinges, is manufactured as planar structures; preferably by a thin film technology such as MEMS.

Inventors:
; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174673
Patent Number(s):
6,675,671
Application Number:
10/153,109
Assignee:
Sandia Corporation (Albuquerque, NM) SNL-L
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Jokiel, Jr., Bernhard, Benavides, Gilbert L., Bieg, Lothar F., and Allen, James J. Planar-constructed spatial micro-stage. United States: N. p., 2004. Web.
Jokiel, Jr., Bernhard, Benavides, Gilbert L., Bieg, Lothar F., & Allen, James J. Planar-constructed spatial micro-stage. United States.
Jokiel, Jr., Bernhard, Benavides, Gilbert L., Bieg, Lothar F., and Allen, James J. Tue . "Planar-constructed spatial micro-stage". United States. https://www.osti.gov/servlets/purl/1174673.
@article{osti_1174673,
title = {Planar-constructed spatial micro-stage},
author = {Jokiel, Jr., Bernhard and Benavides, Gilbert L. and Bieg, Lothar F. and Allen, James J.},
abstractNote = {A multiple degree of freedom platform assembly formed from a plurality of thin films on a substrate can, when activated, move out of the plane of the substrate without additional manufacturing steps. The platform is connected to the substrate by at least three linkages, each linkage being pivotally connected to the platform and the base. At least two of the base connections are to powered traveling devices that are manufactured at one end of a path and which may be moved to locations along the path to cause the platform to move to predetermined positions. The entire assembly, including hinges, is manufactured as planar structures; preferably by a thin film technology such as MEMS.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {1}
}

Patent:

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