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Title: Ultrashort pulse laser machining of metals and alloys

Abstract

The invention consists of a method for high precision machining (cutting, drilling, sculpting) of metals and alloys. By using pulses of a duration in the range of 10 femtoseconds to 100 picoseconds, extremely precise machining can be achieved with essentially no heat or shock affected zone. Because the pulses are so short, there is negligible thermal conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond approximately 0.1-1 micron (dependent upon the particular material) from the laser machined surface. Due to the short duration, the high intensity (>10.sup.12 W/cm.sup.2) associated with the interaction converts the material directly from the solid-state into an ionized plasma. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces with negligible redeposition either within the kerf or on the surface. Since there is negligible heating beyond the depth of material removed, the composition of the remaining material is unaffected by the laser machining process. This enables high precision machining of alloys and even pure metals with no change in grain structure.

Inventors:
;
Issue Date:
Research Org.:
Univ. of California, Oakland, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174492
Patent Number(s):
6621040
Application Number:
08/859,020
Assignee:
The Regents of the University of California (Oakland, CA)
Patent Classifications (CPCs):
A - HUMAN NECESSITIES A61 - MEDICAL OR VETERINARY SCIENCE A61C - DENTISTRY
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
DOE Contract Number:  
W-7405-ENG48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Perry, Michael D., and Stuart, Brent C. Ultrashort pulse laser machining of metals and alloys. United States: N. p., 2003. Web.
Perry, Michael D., & Stuart, Brent C. Ultrashort pulse laser machining of metals and alloys. United States.
Perry, Michael D., and Stuart, Brent C. Tue . "Ultrashort pulse laser machining of metals and alloys". United States. https://www.osti.gov/servlets/purl/1174492.
@article{osti_1174492,
title = {Ultrashort pulse laser machining of metals and alloys},
author = {Perry, Michael D. and Stuart, Brent C.},
abstractNote = {The invention consists of a method for high precision machining (cutting, drilling, sculpting) of metals and alloys. By using pulses of a duration in the range of 10 femtoseconds to 100 picoseconds, extremely precise machining can be achieved with essentially no heat or shock affected zone. Because the pulses are so short, there is negligible thermal conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond approximately 0.1-1 micron (dependent upon the particular material) from the laser machined surface. Due to the short duration, the high intensity (>10.sup.12 W/cm.sup.2) associated with the interaction converts the material directly from the solid-state into an ionized plasma. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces with negligible redeposition either within the kerf or on the surface. Since there is negligible heating beyond the depth of material removed, the composition of the remaining material is unaffected by the laser machining process. This enables high precision machining of alloys and even pure metals with no change in grain structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {9}
}

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Works referenced in this record:

Ablation of metal films by picosecond laser pulses imaged with high‐speed electron microscopy
journal, September 1994


Machining of sub-micron holes using a femtosecond laser at 800 nm
journal, January 1995


Thermophysical effects in laser processing of materials with picosecond and femtosecond pulses
journal, November 1995


Sub-picosecond UV laser ablation of metals
journal, July 1995


Femtosecond pulse laser ablation of metallic, semiconducting, ceramic, and biological materials
conference, September 1994


Sub-picosecond UV-laser ablation of Ni films: Strong fluence reduction and thickness-independent removal
journal, July 1994


Femtosecond-pulse laser processing of metallic and semiconducting thin films
conference, April 1995


Nanosecond-to-femtosecond laser-induced breakdown in dielectrics
journal, January 1996


Laser processing of ceramics and metals by high-intensity picosecond and nanosecond laser pulses in UV, visible, and IR range of spectrum
conference, April 1996


Buffer Gas Effects on the Ablation Rates of Copper Using a Pico-Second Pulsed Nd:YAG Laser
journal, January 1992